LAM; LIT PING
Patent Applications and Registrations
Patent applications and USPTO patent grants for LAM; LIT PING.The latest application filed is for "methods and apparatus for wafer-level packaging using direct writing".
- LAM; LIT PING - SINGAPORE SG
| Patent | Date |
|---|---|
| Methods And Apparatus For Wafer-level Packaging Using Direct Writing App 20210202334 - SUO; PENG ; et al. | 2021-07-01 |
| Lattice Coat Surface Enhancement For Chamber Components App 20210130948 - LAM; Lit Ping ; et al. | 2021-05-06 |
| Methods And Apparatus For Removing Abrasive Particles App 20200306931 - LIANTO; PRAYUDI ; et al. | 2020-10-01 |
| Chamber Injector App 20200071832 - LAU; Shu-Kwan ; et al. | 2020-03-05 |
| Textured Processing Chamber Components And Methods Of Manufacturing Same App 20190177835 - BADUVAMANDA; Cariappa ; et al. | 2019-06-13 |
| Additive Manufactured Moveable Parts App 20170096847 - LIU; Alexander Zhonghong ; et al. | 2017-04-06 |
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