Lam; Kui Kam

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lam; Kui Kam.The latest application filed is for "direct transfer apparatus for electronic components".

Company Profile

4.20.24

Lam; Kui Kam - Hong Kong HK
Lam; Kui Kam - Kwai Chung HK

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Direct transfer apparatus for electronic components Grant 11,136,202 - Lam , et al. October 5, 2	2021-10-05
Direct Transfer Apparatus For Electronic Components App 20210206585 - LAM; Kui Kam ; et al.	2021-07-08
Collet inspection in a semiconductor pick and place apparatus Grant 11,056,377 - Lam , et al. July 6, 2	2021-07-06
Collet Inspection In A Semiconductor Pick And Place Apparatus App 20210005498 - LAM; Kui Kam ; et al.	2021-01-07
System for adjusting relative positions between components of a bonding apparatus Grant 10,882,298 - Woo , et al. January 5, 2	2021-01-05
Die attachment apparatus and method utilizing activated forming gas Grant 10,399,170 - Lam , et al. Sep	2019-09-03
Apparatus and method of determining a bonding position of a die Grant 10,311,597 - Lam , et al.	2019-06-04
Apparatus And Method Of Determining A Bonding Position Of A Die App 20180350097 - LAM; Kui Kam ; et al.	2018-12-06
Pick and place device comprising pick arm correction module Grant 10,014,203 - Lam , et al. July 3, 2	2018-07-03
Apparatus for testing multiple semiconductor dice with increased throughput Grant 9,989,587 - Wong , et al. June 5, 2	2018-06-05
System For Adjusting Relative Positions Between Components Of A Bonding Apparatus App 20180126718 - WOO; Shui Cheung ; et al.	2018-05-10
Pick And Place Device Comprising Pick Arm Correction Module App 20170236734 - LAM; Kui Kam ; et al.	2017-08-17
Apparatus For Testing Multiple Semiconductor Dice With Increased Throughput App 20160334464 - WONG; Yam Mo ; et al.	2016-11-17
Die Attachment Apparatus And Method Utilizing Activated Forming Gas App 20150072473 - LAM; Kui Kam ; et al.	2015-03-12
Method and apparatus for fabricating a light-emitting diode package Grant 8,956,892 - Lam , et al. February 17, 2	2015-02-17
Bonding Apparatus Having A Plurality Of Rotary Transfer Arms For Transferring Electronic Devices For Bonding App 20140341691 - LAM; Kui Kam ; et al.	2014-11-20
Apparatus and method for locating a plurality of placement positions on a carrier object Grant 8,804,136 - Lam , et al. August 12, 2	2014-08-12
Apparatus And Method For Locating A Plurality Of Placement Positions On A Carrier Object App 20140160492 - LAM; Kui Kam ; et al.	2014-06-12
Apparatus for delivering semiconductor components to a substrate Grant 8,590,143 - Lam , et al. November 26, 2	2013-11-26
Method And Apparatus For Fabricating A Light-emitting Diode Package App 20130178002 - LAM; Kui Kam ; et al.	2013-07-11
System For Dispensing Soft Solder For Mounting Semiconductor Chips Using Multiple Solder Wires App 20130119113 - LAM; Kui Kam ; et al.	2013-05-16
Apparatus For Delivering Semiconductor Components To A Substrate During Semiconductor Package Manufacturing App 20120301251 - LAM; Kui Kam ; et al.	2012-11-29
Automatic level adjustment for die bonder Grant 8,293,043 - Chung , et al. October 23, 2	2012-10-23
Method Of Die Bonding Onto Dispensed Adhesives App 20120094440 - CHUNG; Kwok Kee ; et al.	2012-04-19
System For Dispensing Soft Solder For Mounting Semiconductor Chips Using Multiple Solder Wires App 20110272452 - Lam; Kui Kam ; et al.	2011-11-10
Die bonder incorporating dual-head dispenser Grant 7,977,231 - Lam , et al. July 12, 2	2011-07-12
Dispensing solder for mounting semiconductor chips Grant 7,735,715 - Lam , et al. June 15, 2	2010-06-15
Manufacturing process and apparatus therefor utilizing reducing gas Grant 7,648,901 - Tu , et al. January 19, 2	2010-01-19
Dispensing Solder For Mounting Semiconductor Chips App 20090145950 - LAM; Kui Kam ; et al.	2009-06-11
Manufacturing Process And Apparatus Therefor Utilizing Reducing Gas App 20080078145 - TU; Ping Liang ; et al.	2008-04-03
Automatic Level Adjustment For Die Bonder App 20080017293 - Chung; Kwok Kee ; et al.	2008-01-24
Semiconductor apparatus with multiple delivery devices for components Grant 7,179,346 - Lam , et al. February 20, 2	2007-02-20
Apparatus and method for die attachment Grant 6,991,967 - Liu , et al. January 31, 2	2006-01-31
Apparatus and method for die attachment App 20050186019 - Liu, Deming ; et al.	2005-08-25
Semiconductor apparatus with multiple delivery devices for components App 20040244915 - Lam, Kui Kam ; et al.	2004-12-09

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