Lam; Ken

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lam; Ken.The latest application filed is for "method and system for monitoring and assessing road conditions".

Company Profile

1.25.19

Lam; Ken - Walnut CA
Lam; Ken - Verdun CA
Lam; Ken - Colorado Springs CO
Lam; Ken - Picatinny Arsenal NJ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Patient monitoring system Grant 11,272,852 - Lamego , et al. March 15, 2	2022-03-15
Method and system for monitoring and assessing road conditions Grant 11,125,556 - Lam , et al. September 21, 2	2021-09-21
Method And System For Monitoring And Assessing Road Conditions App 20190195628 - Lam; Ken ; et al.	2019-06-27
Patient Monitoring System App 20170196470 - Lamego; Marcelo ; et al.	2017-07-13
Blood pressure measurement method Grant 9,649,054 - Lamego , et al. May 16, 2	2017-05-16
Patient monitoring system Grant 9,532,722 - Lamego , et al. January 3, 2	2017-01-03
Routable array metal integrated circuit package fabricated using partial etching process Grant 8,487,424 - Lam July 16, 2	2013-07-16
Routable array metal integrated circuit package fabricated using partial etching process Grant 8,455,304 - Lam June 4, 2	2013-06-04
Patient Monitoring System App 20120330112 - Lamego; Marcelo ; et al.	2012-12-27
Stacked-die electronics package with planar and three-dimensional inductor elements Grant 8,324,023 - Lam December 4, 2	2012-12-04
Component Stacking for Integrated Circuit Electronic Package App 20120270367 - Lam; Ken	2012-10-25
Component stacking for integrated circuit electronic package Grant 8,237,266 - Lam August 7, 2	2012-08-07
Routable Array Metal Integrated Circuit Package Fabricated Using Partial Etching Process App 20120178214 - Lam; Ken	2012-07-12
Leadless package with internally extended package leads Grant 8,174,099 - Lam May 8, 2	2012-05-08
Blood Pressure Measurement System App 20120059267 - Lamego; Marcelo ; et al.	2012-03-08
Routable Array Metal Integrated Circuit Package Fabricated Using Partial Etching Process App 20120025375 - Lam; Ken	2012-02-02
Metal leadframe package with secure feature Grant 8,022,516 - Lam , et al. September 20, 2	2011-09-20
Wafer-level integrated circuit package with top and bottom side electrical connections Grant 8,018,065 - Lam September 13, 2	2011-09-13
Method and system for increasing circuitry interconnection and component capacity in a multi-component package Grant 7,821,122 - Lam October 26, 2	2010-10-26
Method For Forming An Integral Electromagnetic Radiation Shield In An Electronic Package App 20100051343 - Lam; Ken	2010-03-04
Metal Leadframe Package with Secure Feature App 20100038760 - Lam; Ken ; et al.	2010-02-18
Leadless Package with Internally Extended Package Leads App 20100038759 - Lam; Ken	2010-02-18
Electronic package with integral electromagnetic radiation shield and methods related thereto Grant 7,626,247 - Lam December 1, 2	2009-12-01
Wafer-Level Integrated Circuit Package with Top and Bottom Side Electrical Connections App 20090218698 - Lam; Ken	2009-09-03
Fabricating Low Cost Solder Bumps On Integrated Circuit Wafers App 20090206480 - Lam; Ken	2009-08-20
Component Stacking For Integrated Circuit Electronic Package App 20080105985 - LAM; Ken	2008-05-08
Component stacking for integrated circuit electronic package Grant 7,342,308 - Lam March 11, 2	2008-03-11
Method and system for automatic stabilization and pointing control of a device Grant 7,239,975 - Coleman , et al. July 3, 2	2007-07-03
Method and system for automatic pointing stabilization and aiming control device Grant 7,239,976 - Coleman , et al. July 3, 2	2007-07-03
Method and system for increasing circuitry interconnection and component capacity in a multi-component package App 20070145562 - Lam; Ken	2007-06-28
Method and system for providing an integral radio frequency shield in a molded array package App 20070145539 - Lam; Ken	2007-06-28
Component stacking for integrated circuit electronic package App 20070138629 - Lam; Ken	2007-06-21
Method and system for automatic pointing stabilization and aiming control device App 20070057842 - Coleman; Norman ; et al.	2007-03-15
Method and system for automatic stabilization and pointing control of a device App 20060265120 - Coleman; Norman ; et al.	2006-11-23
Wireless wide area networked precision geolocation App 20050231425 - Coleman, Norman ; et al.	2005-10-20
TAB testing of area array interconnected chips Grant 5,367,763 - Lam November 29, 1	1994-11-29
Bumpless bonding process having multilayer metallization Grant 5,249,728 - Lam October 5, 1	1993-10-05
Method of forming a chip package and package interconnects Grant 5,216,806 - Lam June 8, 1	1993-06-08
Method of forming integrated leadouts for a chip carrier Grant 5,177,863 - Lam January 12, 1	1993-01-12
Pressure sensor header Grant 4,612,227 - Lam , et al. September 16, 1	1986-09-16

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