Lam; John W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lam; John W..The latest application filed is for "methods for forming cobalt interconnects".
- Lam; John W. - San Jose CA
| Patent | Date |
|---|---|
| Electrochemical plating methods Grant 9,704,717 - Lam , et al. July 11, 2 | 2017-07-11 |
| Electrochemical plating methods Grant 9,496,145 - Lam , et al. November 15, 2 | 2016-11-15 |
| Methods For Forming Cobalt Interconnects App 20160309596 - Shaviv; Roey ; et al. | 2016-10-20 |
| Electrochemical Plating Methods App 20150357195 - Lam; John W. ; et al. | 2015-12-10 |
| Electrochemical Plating Methods App 20150270133 - Lam; John W. ; et al. | 2015-09-24 |
| Method of forming a magnetic read/write head Grant 7,770,285 - Bonhote , et al. August 10, 2 | 2010-08-10 |
| Stress relief for electroplated films Grant 7,459,198 - Bonhote , et al. December 2, 2 | 2008-12-02 |
| Head Design With Low Coefficient of Thermal Expansion Insert Layer App 20080172862 - Bonhote; Christian R. ; et al. | 2008-07-24 |
| Encapsulation of chemically amplified resist template for low pH electroplating App 20070020386 - Bedell; Daniel W. ; et al. | 2007-01-25 |
| Head design with low coefficient of thermal expansion insert layer App 20060221498 - Bonhote; Christian R. ; et al. | 2006-10-05 |
| Method for lowering deposition stress, improving ductility, and enhancing lateral growth in electrodeposited iron-containing alloys App 20060222871 - Bonhote; Christian Rene ; et al. | 2006-10-05 |
| Stress relief for electroplated films App 20050266262 - Bonhote, Christian R. ; et al. | 2005-12-01 |
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