Lam; Gary

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lam; Gary.The latest application filed is for "method and apparatus for polishing metal and dielectric substrates".

Company Profile

0.5.4

Lam; Gary - Millbrae CA
Lam; Gary - Santa Clara CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Efficient online training for machine learning Grant 11,132,602 - Xie , et al. September 28, 2	2021-09-28
Method of chemical mechanical polishing with high throughput and low dishing Grant 7,232,761 - Li , et al. June 19, 2	2007-06-19
Method and apparatus for polishing metal and dielectric substrates Grant 6,960,521 - Moon , et al. November 1, 2	2005-11-01
Method and apparatus for polishing metal and dielectric substrates App 20050032381 - Moon, Yongsik ; et al.	2005-02-10
Method of chemical mechanical polishing with high throughput and low dishing App 20050026442 - Li, Shijian ; et al.	2005-02-03
Methods and apparatus for polishing substrates comprising conductive and dielectric materials with reduced topographical defects Grant 6,790,768 - Moon , et al. September 14, 2	2004-09-14
Method of chemical mechanical polishing with high throughput and low dishing Grant 6,780,773 - Li , et al. August 24, 2	2004-08-24
Method and apparatus for polishing metal and dielectric substrates App 20030029841 - Moon, Yongsik ; et al.	2003-02-13
Method of chemical mechanical polishing with high throughput and low dishing App 20030022497 - Li, Shijian ; et al.	2003-01-30

Company Registrations

SEC

0001298593

Lam Gary

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