Lakhera; Nishant
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lakhera; Nishant.The latest application filed is for "conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes".
- Lakhera; Nishant - Austin TX
| Patent | Date |
|---|---|
| Conduit Inserts For Encapsulant Compound Formulation Kneading And Encapsulation Back-end Assembly Processes App 20220250301 - Chopin; Sheila F. ; et al. | 2022-08-11 |
| Packaged Semiconductor Device Assembly App 20220093499 - Singh; Akhilesh Kumar ; et al. | 2022-03-24 |
| Package with conductive underfill ground plane Grant 11,270,972 - Lakhera , et al. March 8, 2 | 2022-03-08 |
| Hybrid package Grant 11,189,557 - Singh , et al. November 30, 2 | 2021-11-30 |
| Package With Conductive Underfill Ground Plane App 20200395332 - LAKHERA; Nishant ; et al. | 2020-12-17 |
| Hybrid Package App 20200185319 - Singh; Akhilesh Kumar ; et al. | 2020-06-11 |
| Hybrid Package App 20200013711 - Singh; Akhilesh Kumar ; et al. | 2020-01-09 |
| Package with support structure Grant 10,431,534 - Lakhera , et al. O | 2019-10-01 |
| Package With Support Structure App 20190181079 - Lakhera; Nishant ; et al. | 2019-06-13 |
| Package With Isolation Structure App 20190157222 - LAKHERA; Nishant ; et al. | 2019-05-23 |
| Selectively Shielded Semiconductor Package App 20190103365 - SINGH; Akhilesh Kumar ; et al. | 2019-04-04 |
| Die attachment for packaged semiconductor device Grant 10,217,698 - Singh , et al. Feb | 2019-02-26 |
| Apparatus and methods for multi-die packaging Grant 10,211,184 - Lakhera , et al. Feb | 2019-02-19 |
| Wafer level chip scale package with encapsulant Grant 10,147,645 - Oratti Kalandar , et al. De | 2018-12-04 |
| Structure and method to minimize warpage of packaged semiconductor devices Grant 9,978,614 - Lakhera , et al. May 22, 2 | 2018-05-22 |
| Electronic Component Package With Heatsink And Multiple Electronic Components App 20180114745 - ORATTI KALANDAR; NAVAS KHAN ; et al. | 2018-04-26 |
| Electronic component package with heatsink and multiple electronic components Grant 9,953,904 - Oratti Kalandar , et al. April 24, 2 | 2018-04-24 |
| Packaged semiconductor device having bent leads and method for forming Grant 9,947,614 - Oratti Kalandar , et al. April 17, 2 | 2018-04-17 |
| Stackable Molded Packages And Methods Of Manufacture Thereof App 20180053753 - Singh; Akhilesh Kumar ; et al. | 2018-02-22 |
| Apparatus And Methods For Multi-die Packaging App 20180053749 - LAKHERA; Nishant ; et al. | 2018-02-22 |
| Apparatus and Methods for Multi-Die Packaging App 20170278825 - LAKHERA; Nishant ; et al. | 2017-09-28 |
| Packaged Semiconductor Device Having Bent Leads And Method For Forming App 20170263538 - ORATTI KALANDAR; Navas Khan ; et al. | 2017-09-14 |
| Method for packaging an integrated circuit device with stress buffer Grant 9,691,637 - Oratti Kalandar , et al. June 27, 2 | 2017-06-27 |
| Method For Packaging An Integrated Circuit Device With Stress Buffer App 20170103905 - ORATTI KALANDAR; NAVAS KHAN ; et al. | 2017-04-13 |
| Die Attachment For Packaged Semiconductor Device App 20170098597 - SINGH; AKHILESH K. ; et al. | 2017-04-06 |
| Wafer Level Chip Scale Package With Encapsulant App 20170084491 - ORATTI KALANDAR; NAVAS KHAN ; et al. | 2017-03-23 |
| Die attachment for packaged semiconductor device Grant 9,559,077 - Singh , et al. January 31, 2 | 2017-01-31 |
| Apparatus and methods for stackable packaging Grant 9,508,632 - Oratti Kalandar , et al. November 29, 2 | 2016-11-29 |
| Structure And Method To Minimize Warpage Of Packaged Semiconductor Devices App 20160307780 - LAKHERA; Nishant ; et al. | 2016-10-20 |
| Die Attachment For Packaged Semiconductor Device App 20160118365 - SINGH; AKHILESH K. ; et al. | 2016-04-28 |
| Structure And Method To Minimize Warpage Of Packaged Semiconductor Devices App 20160064299 - LAKHERA; NISHANT ; et al. | 2016-03-03 |
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