Lake; Rickie C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lake; Rickie C..The latest application filed is for "methods for forming conductive elements and vias on substrates and for forming multi-chip modules".

Company Profile

0.105.42

Lake; Rickie C. - Meridian ID
Lake; Rickie C. - Sunnyvale CA US
Lake; Rickie C. - Eagle ID US
Lake; Rickie C. - Boise ID

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Microfeature workpieces having alloyed conductive structures, and associated methods Grant 9,737,947 - Farnworth , et al. August 22, 2	2017-08-22
Hermetic sealing of optical module Grant 9,612,409 - Finot , et al. April 4, 2	2017-04-04
Methods for forming conductive elements and vias on substrates and for forming multi-chip modules Grant 9,153,491 - Lake October 6, 2	2015-10-06
Methods For Forming Conductive Elements And Vias On Substrates And For Forming Multi-chip Modules App 20150031171 - Lake; Rickie C.	2015-01-29
Microfeature Workpieces Having Alloyed Conductive Structures, And Associated Methods App 20140284375 - Farnworth; Warren M. ; et al.	2014-09-25
Methods for forming conductive elements and vias on substrates Grant 8,835,293 - Lake September 16, 2	2014-09-16
Wafer processing Grant 8,415,233 - Lake April 9, 2	2013-04-09
Method and apparatus for RFID communication Grant RE43,940 - Tuttle , et al. January 22, 2	2013-01-22
Method and apparatus for RFID communication Grant RE43,935 - Tuttle , et al. January 15, 2	2013-01-15
Method and apparatus for RFID communication Grant RE43,918 - Tuttle , et al. January 8, 2	2013-01-08
Apparatus For Wafer-to-wafer Bonding App 20120186741 - LAKE; RICKIE C.	2012-07-26
Methods For Forming Conductive Elements And Vias On Substrates App 20120175341 - Lake; Rickie C.	2012-07-12
Methods of forming conductive vias through substrates, and structures and assemblies resulting therefrom Grant 8,183,151 - Lake May 22, 2	2012-05-22
Method and apparatus for communicating with RFID devices coupled to a roll of flexible material Grant RE42,872 - Tuttle , et al. October 25, 2	2011-10-25
Method of manufacturing an enclosed transceiver Grant RE42,773 - Tuttle , et al. October 4, 2	2011-10-04
Wafer Processing App 20110233705 - Lake; Rickie C.	2011-09-29
Wafer processing Grant 7,972,940 - Lake July 5, 2	2011-07-05
Method and apparatus for step-and-repeat molding Grant 7,968,042 - Lake June 28, 2	2011-06-28
Optic wafer with reliefs, wafer assembly including same and methods of dicing wafer assembly Grant 7,927,916 - Lake April 19, 2	2011-04-19
Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure Grant 7,888,758 - Lake February 15, 2	2011-02-15
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers Grant 7,723,741 - Farnworth , et al. May 25, 2	2010-05-25
Apparatus and Method of Manufacture for Movable Lens on Transparent Substrate App 20100123209 - Duparre; Jacques ; et al.	2010-05-20
Semiconductor substrates including vias of nonuniform cross-section and associated structures Grant 7,687,916 - Lake March 30, 2	2010-03-30
Method And Apparatus For Step-and-repeat Molding App 20090261516 - Lake; Rickie C.	2009-10-22
Method of forming a permanent carrier and spacer wafer for wafer level optics and associated structure App 20090231826 - Lake; Rickie C.	2009-09-17
Wafer Processing App 20090166782 - Lake; Rickie C.	2009-07-02
Optoelectronic housings and methods of assembling optoelectronic packages Grant 7,534,053 - Lake May 19, 2	2009-05-19
Thin profile battery bonding method, method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit Grant 7,511,616 - Lake March 31, 2	2009-03-31
Thin Profile Battery Bonding Method, Method Of Conductively Interconnecting Electronic Components, Battery Powerable Apparatus, Radio Frequency Communication Device, And Electric Circuit App 20080291027 - Lake; Rickie C.	2008-11-27
Methods Of Forming Conductive Vias Through Substrates, And Structures And Assemblies Resulting Therefrom App 20080272497 - Lake; Rickie C.	2008-11-06
Semiconductor Substrates Including Vias Of Nonuniform Cross Section And Associated Structures App 20080272466 - Lake; Rickie C.	2008-11-06
Optic wafer with reliefs, wafer assembly including same and methods of dicing wafer assembly App 20080246066 - Lake; Rickie C.	2008-10-09
Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures Grant 7,425,507 - Lake September 16, 2	2008-09-16
Circuit package and method of plating the same Grant 7,405,155 - Yao , et al. July 29, 2	2008-07-29
Methods for forming integrated circuits within substrates Grant RE40,137 - Tuttle , et al. March 4, 2	2008-03-04
Methods And Apparatuses For Releasably Attaching Microfeature Workpieces To Support Members App 20070134471 - Lake; Rickie C. ; et al.	2007-06-14
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers Grant 7,223,626 - Farnworth , et al. May 29, 2	2007-05-29
Wafer backside removal to complete through-holes and provide wafer singulation during the formation of a semiconductor device Grant 7,199,449 - Lake April 3, 2	2007-04-03
Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures App 20060292877 - Lake; Rickie C.	2006-12-28
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers App 20060234422 - Farnworth; Warren M. ; et al.	2006-10-19
Methods and apparatus for releasably attaching microfeature workpieces to support members App 20060162850 - Lake; Rickie C. ; et al.	2006-07-27
Optoelectronic package having a transmission line between electrical components and optical components Grant 7,076,123 - Kirkpatrick , et al. July 11, 2	2006-07-11
Circuit package and method of plating the same App 20060121732 - Yao; Xiaowei ; et al.	2006-06-08
Circuit package and method of plating the same Grant 7,019,394 - Yao , et al. March 28, 2	2006-03-28
Wafer backside removal to complete through-holes and provide wafer singulation during the formation of a semiconductor device App 20060043533 - Lake; Rickie C.	2006-03-02
Spacers for packaged microelectronic imagers and methods of making and using spacers for wafer-level packaging of imagers App 20060040421 - Farnworth; Warren M. ; et al.	2006-02-23
Method of attaching an optical fiber to a flexure Grant 6,950,594 - Lake September 27, 2	2005-09-27
Epoxy, epoxy system, and method of forming a conductive adhesive connection Grant 6,902,689 - Lake , et al. June 7, 2	2005-06-07
Battery powerable apparatus, radio frequency communication device, and electric circuit Grant 6,885,089 - Lake April 26, 2	2005-04-26
Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methods Grant 6,882,284 - Lake , et al. April 19, 2	2005-04-19
Method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit Grant 6,881,294 - Lake April 19, 2	2005-04-19
Circuit package and method of plating the same App 20050077609 - Yao, Xiaowei ; et al.	2005-04-14
Hermetic sealing of optical module App 20050058411 - Finot, Marc A. ; et al.	2005-03-17
Optoelectronic housings and methods of assembling optoelectronic packages App 20040264889 - Lake, Rickie C.	2004-12-30
Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs Grant 6,821,032 - Lake , et al. November 23, 2	2004-11-23
Ferrule flexure assembly for optical modules App 20040202433 - Lake, Rickie C.	2004-10-14
Thin profile battery bonding method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit App 20040166827 - Lake, Rickie C.	2004-08-26
Optoelectronic housings and methods of assembling optoelectronic packages Grant 6,773,171 - Lake August 10, 2	2004-08-10
Optoelectronic housings and methods of assembling optoelectronic packages App 20040136661 - Lake, Rickie C.	2004-07-15
Method of fabricating a wireless radio frequency identification device Grant 6,666,379 - Lake December 23, 2	2003-12-23
Methods of sealing electronic, optical and electro-optical packages and related package and substrate designs App 20030223709 - Lake, Rickie C. ; et al.	2003-12-04
Electrical apparatuses, and methods of forming electrical apparatuses Grant 6,630,887 - Lake October 7, 2	2003-10-07
Method of attaching an optical fiber to a flexure App 20030174999 - Lake, Rickie C.	2003-09-18
Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methods App 20030128119 - Lake, Rickie C. ; et al.	2003-07-10
Method of fabricating a wireless radio frequency identification device App 20030057287 - Lake, Rickie C.	2003-03-27
Termite sensing methods Grant 6,515,591 - Lake , et al. February 4, 2	2003-02-04
Thin Profile Battery Bonding Method, Method Of Conductively Interconnecting Electronic Components, Battery Powerable Apparatus, Radio Frequency Communication Device, And Electric Circuit App 20020179239 - LAKE, RICKIE C.	2002-12-05
In-sheet transceiver testing Grant 6,487,681 - Tuttle , et al. November 26, 2	2002-11-26
Method of fabricating a remote intelligent communications device Grant 6,471,129 - Lake October 29, 2	2002-10-29
Methods of fixturing a flexible substrate and a processing carrier and methods of processing a flexible substrate Grant 6,458,234 - Lake , et al. October 1, 2	2002-10-01
Electrical apparatuses, and methods of forming electrical apparatuses Grant 6,392,545 - Lake , et al. May 21, 2	2002-05-21
Method of manufacturing an enclosed transceiver Grant 6,375,780 - Tuttle , et al. April 23, 2	2002-04-23
Devices for sensing changes in environments proximate the devices, devices for sensing termites, and methods for sensing termites Grant 6,373,391 - Lake , et al. April 16, 2	2002-04-16
Battery powerable apparatus, radio frequency communication device, and electric circuit App 20020035780 - Lake, Rickie C.	2002-03-28
Method of manufacturing and testing an electronic device, and an electronic device Grant 6,359,561 - Tuttle , et al. March 19, 2	2002-03-19
Method Of Fabricating A Remote Intelligent Communications Device App 20020030111 - LAKE, RICKIE C.	2002-03-14
Methods for forming integrated circuits within substrates Grant 6,329,213 - Tuttle , et al. December 11, 2	2001-12-11
Method of manufacturing an enclosed transceiver Grant 6,325,294 - Tuttle , et al. December 4, 2	2001-12-04
Electrical apparatuses, termite sensing apparatuses, methods of forming electrical apparatuses, and methods of sensing termites Grant 6,313,748 - Lake November 6, 2	2001-11-06
Methods of forming flip chip bumps and related flip chip bump constructions Grant 6,309,954 - Lake October 30, 2	2001-10-30
Radio frequency-transmissive compositions, methods of forming radio frequency-transmissive compositions, microelectronic devices, wireless radio frequency communication devices, and methods of forming microelectronic devices, wireless radio frequency communication devices App 20010031630 - Lake, Rickie C.	2001-10-18
Devices for sensing living organisms, devices for sensing termites, methods of forming devices for sensing termites, and methods for sensing termites Grant 6,304,185 - Tuttle , et al. October 16, 2	2001-10-16
Epoxy, epoxy system, and method of forming a conductive adhesive connection App 20010025947 - Lake, Rickie C. ; et al.	2001-10-04
Embedded circuits Grant 6,271,801 - Tuttle , et al. August 7, 2	2001-08-07
Batteries App 20010010879 - Lake, Rickie C.	2001-08-02
Method of manufacturing an enclosed transceiver App 20010007335 - Tuttle, Mark E. ; et al.	2001-07-12
Electrical apparatuses, methods of forming electrical apparatuses, and termite sensing methods Grant 6,255,959 - Lake , et al. July 3, 2	2001-07-03
Circuitry interconnection method Grant 6,251,211 - Lake June 26, 2	2001-06-26
Termite sensing methods App 20010004237 - Lake, Rickie C. ; et al.	2001-06-21
Embedded Circuits App 20010002826 - TUTTLE, MARK E. ; et al.	2001-06-07
Electrical apparatuses, termite sensing apparatuses, and methods of forming electrical apparatuses Grant 6,243,014 - Lake , et al. June 5, 2	2001-06-05
Method of manufacturing and testing an electronic device, and an electronic device App 20010002106 - Tuttle, Mark E. ; et al.	2001-05-31
Electrical apparatuses, and methods of forming electrical apparatuses App 20010001236 - Lake, Rickie C.	2001-05-17
Methods of insulating a thin-profile battery Grant 6,231,625 - Lake May 15, 2	2001-05-15
Method of manufacturing an enclosed transceiver Grant 6,220,516 - Tuttle , et al. April 24, 2	2001-04-24
Electrical apparatuses, and methods of forming electrical apparatuses App 20010000299 - Lake, Rickie C. ; et al.	2001-04-19
Radio frequency communication apparatus and methods of forming a radio frequency communication apparatus Grant 6,177,859 - Tuttle , et al. January 23, 2	2001-01-23
Method of manufacturing and testing an electronic device, and an electronic device Grant 6,167,614 - Tuttle , et al. January 2, 2	2001-01-02
Electronic circuits and circuit boards Grant 6,166,915 - Lake , et al. December 26, 2	2000-12-26
Battery mounting apparatuses, electronic devices, and methods of forming electrical connections Grant 6,161,281 - Dando , et al. December 19, 2	2000-12-19
Electronic circuit bonding interconnect component and flip chip interconnect bond Grant 6,114,239 - Lake , et al. September 5, 2	2000-09-05
Polymer-lithium batteries and improved methods for manufacturing batteries Grant RE36,843 - Lake , et al. August 29, 2	2000-08-29
Method of manufacturing and testing an electronic device, and an electronic device Grant 6,104,280 - Tuttle , et al. August 15, 2	2000-08-15
Devices for sensing termites and other living organisms, and methods of forming devices for sensing termites Grant 6,100,805 - Lake August 8, 2	2000-08-08
Methods of forming flip chip bumps and related flip chip bump constructions Grant 6,083,773 - Lake July 4, 2	2000-07-04
Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices Grant 6,081,243 - Lake June 27, 2	2000-06-27
Radio frequency identification transceiver and antenna Grant 6,078,791 - Tuttle , et al. June 20, 2	2000-06-20
Methods of forming conductive lines, methods of forming antennas, methods of forming wireless communication devices, conductive lines, antennas, and wireless communications devices Grant 6,067,056 - Lake May 23, 2	2000-05-23
Fluid mixing and withdrawing methods Grant 6,062,722 - Lake May 16, 2	2000-05-16
Method of manufacturing an enclosed transceiver Grant 6,045,652 - Tuttle , et al. April 4, 2	2000-04-04
Electronic devices and methods of forming electronic devices Grant 6,043,745 - Lake March 28, 2	2000-03-28
Wireless communication devices, radio frequency identification devices, and methods of forming wireless communication devices and radio frequency identification devices Grant 6,031,459 - Lake February 29, 2	2000-02-29
Thin profile battery bonding method and method of conductively interconnecting electronic components Grant 6,030,423 - Lake February 29, 2	2000-02-29
Batteries comprising an ink layer Grant 6,030,721 - Lake February 29, 2	2000-02-29
Methods of forming battery electrodes Grant 6,004,359 - Lake December 21, 1	1999-12-21
Thin-profile battery electrode connection members, button-type battery electrode connection members, thin-profile battery constructions and button-type battery constructions Grant 5,998,061 - Lake December 7, 1	1999-12-07
Radio frequency identification system, radio frequency identification device package, and method of use of radio frequency identification device Grant 5,986,569 - Mish , et al. November 16, 1	1999-11-16
In-sheet transceiver testing Grant 5,983,363 - Tuttle , et al. November 9, 1	1999-11-09
Methods of fixturing flexible circuit substrates and a processing carrier, processing a flexible circuit and processing a flexible circuit substrate relative to a processing carrier Grant 5,972,152 - Lake , et al. October 26, 1	1999-10-26
Methods of enhancing electronmagnetic radiation properties of encapsulated circuit, and related devices Grant 5,963,177 - Tuttle , et al. October 5, 1	1999-10-05
Method of forming a circuit board Grant 5,937,512 - Lake , et al. August 17, 1	1999-08-17
Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant Grant 5,907,477 - Tuttle , et al. May 25, 1	1999-05-25
Battery constructions and method for forming such battery constructions Grant 5,906,661 - Lake May 25, 1	1999-05-25
Method of forming batteries with printed cathode layers Grant 5,865,859 - Lake February 2, 1	1999-02-02
Electronic circuit bonding interconnect component and flip chip interconnect bond Grant 5,804,876 - Lake , et al. September 8, 1	1998-09-08
Method of manufacturing an enclosed transceiver Grant 5,779,839 - Tuttle , et al. July 14, 1	1998-07-14
Method of manufacturing an enclosed transceiver Grant 5,776,278 - Tuttle , et al. July 7, 1	1998-07-07
Multilayered battery having a cured conductive ink layer Grant 5,747,190 - Lake May 5, 1	1998-05-05
Multilayered battery having a cured conductive ink layer Grant 5,747,191 - Lake May 5, 1	1998-05-05
Methods of forming battery electrodes Grant 5,735,912 - Lake April 7, 1	1998-04-07
Method for forming battery constructions Grant 5,735,914 - Lake April 7, 1	1998-04-07
Battery package and method using flexible polymer films having a deposited layer of an inorganic material Grant RE35,746 - Lake March 17, 1	1998-03-17
Method of forming a battery and battery Grant 5,705,294 - Lake January 6, 1	1998-01-06
Electrical circuit bonding interconnect component and flip chip interconnect bond Grant 5,663,598 - Lake , et al. September 2, 1	1997-09-02
Battery having orifices for connection with electrode terminals Grant 5,658,684 - Lake August 19, 1	1997-08-19
Method for fabricating a leadless battery employing an alkali metal anode and polymer film inks Grant 5,624,468 - Lake April 29, 1	1997-04-29
Article and method of manufacturing an enclosed electrical circuit using an encapsulant Grant 5,612,513 - Tuttle , et al. March 18, 1	1997-03-18
Method and apparatus for mounting a component to a substrate using an anisotropic adhesive, a compressive cover film, and a conveyor Grant 5,605,547 - Lake February 25, 1	1997-02-25
Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent Grant 5,480,834 - Lake , et al. January 2, 1	1996-01-02
Enclosed transceiver Grant 5,448,110 - Tuttle , et al. September 5, 1	1995-09-05
Polymer-lithium batteries and improved methods for manufacturing batteries Grant 5,350,645 - Lake , et al. September 27, 1	1994-09-27
Battery package and method using flexible polymer films having a deposited layer of an inorganic material Grant 5,326,652 - Lake July 5, 1	1994-07-05