Laing; Mark

Patent Applications and Registrations

Patent applications and USPTO patent grants for Laing; Mark.The latest application filed is for "part number consolidation in printed circuit board assembly design".

Company Profile

2.5.6

Laing; Mark - Lafayette CO
Laing; Mark - East Yorkshire GB
Laing; Mark - Mira IT
Laing; Mark - Beverley GB

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Part number consolidation in printed circuit board assembly design Grant 10,657,297 - Aarras , et al.	2020-05-19
Part Number Consolidation In Printed Circuit Board Assembly Design App 20190370417 - Aarras; Sami ; et al.	2019-12-05
Test capability-based printed circuit board assembly design Grant 10,430,538 - Laing O	2019-10-01
Test Capability-based Printed Circuit Board Assembly Design App 20180218099 - Laing; Mark	2018-08-02
Device for providing a relatively constant rate of dissolution of a solid article within it Grant 8,142,731 - Costiniti , et al. March 27, 2	2012-03-27
Crosslinking of netlists Grant 7,653,886 - Laing January 26, 2	2010-01-26
Crosslinking Of Netlists App 20080288907 - Laing; Mark	2008-11-20
Device for Providing a Relatively Constant Rate of Dissolution of a Solid Article within It App 20080202172 - Costiniti; Fabio ; et al.	2008-08-28
Water-Softening Method App 20080053910 - Ayats; Francesc ; et al.	2008-03-06
Water-Softening Product and Process for Its Preparation and Use Thereof App 20080000837 - Ardite Ayats; Francesc ; et al.	2008-01-03
Hard surface cleaners comprising an ethoxylated quaternary ammonium compound and an anionic surfactant Grant 6,358,900 - Wigley , et al. March 19, 2	2002-03-19

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