Laine; Eric H.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Laine; Eric H..The latest application filed is for "interconnection for flip-chip using lead-free solders and having improved reaction barrier layers".
- Laine; Eric H. - Binghamton NY
| Patent | Date |
|---|---|
| Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Grant 8,314,500 - Belanger , et al. November 20, 2 | 2012-11-20 |
| Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Grant 7,932,169 - Belanger , et al. April 26, 2 | 2011-04-26 |
| Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers App 20100062597 - Belanger; Luc ; et al. | 2010-03-11 |
| Interconnections For Flip-chip Using Lead-free Solders And Having Improved Reaction Barrier Layers App 20080157395 - Belanger; Luc ; et al. | 2008-07-03 |
| Process of producing plastic pin grid array Grant 6,438,830 - Dibble , et al. August 27, 2 | 2002-08-27 |
| Pin attach structure for an electronic package Grant 5,952,716 - Dibble , et al. September 14, 1 | 1999-09-14 |
| Electronic package Grant 5,616,958 - Laine , et al. April 1, 1 | 1997-04-01 |
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