loadpatents
Patent applications and USPTO patent grants for Lai; Yi-Shao.The latest application filed is for "semiconductor package and manufacturing method thereof".
Patent | Date |
---|---|
Semiconductor package having a trench penetrating a main body Grant 10,056,325 - Kao , et al. August 21, 2 | 2018-08-21 |
Semiconductor Package And Manufacturing Method Thereof App 20170133311 - KAO; Chin-Li ;   et al. | 2017-05-11 |
Semiconductor package and manufacturing method thereof Grant 9,589,840 - Kao , et al. March 7, 2 | 2017-03-07 |
Semiconductor Package And Manufacturing Method Thereof App 20140332957 - KAO; Chin-Li ;   et al. | 2014-11-13 |
Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof Grant 8,592,982 - Lai , et al. November 26, 2 | 2013-11-26 |
Semiconductor package Grant 8,421,242 - Chang , et al. April 16, 2 | 2013-04-16 |
Semiconductor package Grant 8,368,216 - Lai , et al. February 5, 2 | 2013-02-05 |
Semiconductor device package having a buffer structure and method of fabricating the same Grant 8,274,149 - Chang , et al. September 25, 2 | 2012-09-25 |
Apparatus and method for testing non-contact pads of a semiconductor device to be tested Grant 8,253,431 - Lai , et al. August 28, 2 | 2012-08-28 |
Semiconductor device package having a jumper chip and method of fabricating the same Grant 8,222,726 - Chang , et al. July 17, 2 | 2012-07-17 |
Semiconductor device package Grant 8,222,733 - Cheng , et al. July 17, 2 | 2012-07-17 |
Semiconductor Package Having Proximity Communication Signal Input Terminals And Manufacturing Methods Thereof App 20120153489 - LAI; YI-SHAO ;   et al. | 2012-06-21 |
Advanced Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof App 20120119342 - Chang Chien; Pao-Huei ;   et al. | 2012-05-17 |
Semiconductor Package And Method For Making The Same App 20120091575 - Lai; Yi-Shao ;   et al. | 2012-04-19 |
Semiconductor Package And Method For Making The Same App 20120049360 - Lai; Yi-Shao ;   et al. | 2012-03-01 |
Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof Grant 8,115,285 - Chen , et al. February 14, 2 | 2012-02-14 |
Wafer and semiconductor package Grant 8,110,931 - Chang , et al. February 7, 2 | 2012-02-07 |
Semiconductor Package And Method For Making The Same App 20110309516 - Lai; Yi-Shao ;   et al. | 2011-12-22 |
Semiconductor package and method for packaging a semiconductor package Grant 8,076,786 - Hung , et al. December 13, 2 | 2011-12-13 |
Semiconductor Package App 20110298139 - Lai; Yi-Shao ;   et al. | 2011-12-08 |
Semiconductor package and method for making the same Grant 8,072,064 - Lai , et al. December 6, 2 | 2011-12-06 |
Apparatus and Method for Testing Non-Contact Pads of a Semiconductor Device to be Tested App 20110291690 - Lai; Yi-Shao ;   et al. | 2011-12-01 |
Semiconductor Package App 20110278739 - Lai; Yi-Shao ;   et al. | 2011-11-17 |
Semiconductor package and method for processing and bonding a wire Grant 8,053,906 - Chang , et al. November 8, 2 | 2011-11-08 |
Semiconductor Device Package And Method Of Fabricating The Same App 20110233749 - CHANG; Hsiao-Chuan ;   et al. | 2011-09-29 |
Semiconductor Device Package And Method Of Fabricating The Same App 20110233764 - CHANG; Hsiao-Chuan ;   et al. | 2011-09-29 |
Semiconductor Device Package And Method Of Fabricating The Same App 20110227212 - CHENG; Ming-Hsiang ;   et al. | 2011-09-22 |
Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package Grant 8,018,075 - Chang , et al. September 13, 2 | 2011-09-13 |
Bonding strength measuring device Grant 7,980,757 - Lai , et al. July 19, 2 | 2011-07-19 |
Semiconductor Package App 20110156243 - CHANG; Hsiao-Chuan ;   et al. | 2011-06-30 |
Test Kit For Testing A Chip Subassembly And A Testing Method By Using The Same App 20110156739 - CHANG; Hsiao-Chuan ;   et al. | 2011-06-30 |
Tenon-and-mortise packaging structure Grant 7,964,949 - Lai , et al. June 21, 2 | 2011-06-21 |
Chip structure and stacked chip package as well as method for manufacturing chip structures Grant 7,955,897 - Tsai , et al. June 7, 2 | 2011-06-07 |
Wafer And Semiconductor Package App 20100007004 - CHANG; Hsiao Chuan ;   et al. | 2010-01-14 |
Semiconductor Package And Method For Packaging A Semiconductor Package App 20100007011 - HUNG; Chang Ying ;   et al. | 2010-01-14 |
Semiconductor Package And Method For Processing And Bonding A Wire App 20100007009 - CHANG; Hsiao Chuan ;   et al. | 2010-01-14 |
Semiconductor Package, Method For Enhancing The Bond Of A Bonding Wire, And Method For Manufacturing A Semiconductor Package App 20100007010 - CHANG; Hsiao Chuan ;   et al. | 2010-01-14 |
Chip Structure And Stacked Chip Package As Well As Method For Manufacturing Chip Structures App 20090230564 - TSAI; Tsung Yueh ;   et al. | 2009-09-17 |
Advanced Quad Flat No Lead Chip Package Having A Protective Layer To Enhance Surface Mounting And Manufacturing Methods Thereof App 20090230526 - Chen; Chien-Wen ;   et al. | 2009-09-17 |
Bonding Strength Measuring Device App 20090175312 - Lai; Yi-Shao ;   et al. | 2009-07-09 |
Tenon-and-mortise packaging structure App 20090096077 - Lai; Yi-Shao ;   et al. | 2009-04-16 |
Package structure and manufacturing method thereof App 20090051048 - Lai; Yi-Shao ;   et al. | 2009-02-26 |
Package structure and manufacturing method thereof App 20090051031 - Lai; Yi-Shao ;   et al. | 2009-02-26 |
Chip packaging process Grant 7,482,204 - Kao , et al. January 27, 2 | 2009-01-27 |
Tensile test method Grant 7,444,884 - Lai November 4, 2 | 2008-11-04 |
Chip Packaging Process App 20080096325 - Kao; Chin-Li ;   et al. | 2008-04-24 |
Chip package structure and chip packaging process Grant 7,335,982 - Kao , et al. February 26, 2 | 2008-02-26 |
Bonding strength testing device Grant 7,329,900 - Yeh , et al. February 12, 2 | 2008-02-12 |
Tensile Test Method App 20080011097 - Lai; Yi-Shao | 2008-01-17 |
Stacked Chip Package App 20070284756 - TSAI; Tsung Yueh ;   et al. | 2007-12-13 |
Chip Structure And Chip Manufacturing Process App 20070145604 - Kao; Chin-Li ;   et al. | 2007-06-28 |
Bonding Strength Testing Device App 20060231834 - Yeh; Chang-Lin ;   et al. | 2006-10-19 |
Tensile Test Fixture And Tensile Test Method App 20060117865 - Lai; Yi-Shao | 2006-06-08 |
Asymmetric bump structure App 20050263883 - Wang, Tong-Hong ;   et al. | 2005-12-01 |
Chip Package Structure And Chip Packaging Process App 20050224956 - Kao, Chin-Li ;   et al. | 2005-10-13 |
Chip Package Structure App 20050224936 - Wu, Jeng-Dah ;   et al. | 2005-10-13 |
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