loadpatents
name:-0.037515878677368
name:-0.026317834854126
name:-0.00047492980957031
Lai; Yi-Shao Patent Filings

Lai; Yi-Shao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Yi-Shao.The latest application filed is for "semiconductor package and manufacturing method thereof".

Company Profile
0.25.34
  • Lai; Yi-Shao - Kaohsiung TW
  • Lai; Yi-Shao - Taipei N/A TW
  • Lai; Yi-Shao - Yonghe N/A TW
  • LAI; YI-SHAO - Taipei City TW
  • Lai; Yi-Shao - Taipei County TW
  • LAI; Yi-Shao - Yonghe City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor package having a trench penetrating a main body
Grant 10,056,325 - Kao , et al. August 21, 2		2018-08-21
Semiconductor Package And Manufacturing Method Thereof
App 20170133311 - KAO; Chin-Li ;   et al.		2017-05-11
Semiconductor package and manufacturing method thereof
Grant 9,589,840 - Kao , et al. March 7, 2		2017-03-07
Semiconductor Package And Manufacturing Method Thereof
App 20140332957 - KAO; Chin-Li ;   et al.		2014-11-13
Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof
Grant 8,592,982 - Lai , et al. November 26, 2		2013-11-26
Semiconductor package
Grant 8,421,242 - Chang , et al. April 16, 2		2013-04-16
Semiconductor package
Grant 8,368,216 - Lai , et al. February 5, 2		2013-02-05
Semiconductor device package having a buffer structure and method of fabricating the same
Grant 8,274,149 - Chang , et al. September 25, 2		2012-09-25
Apparatus and method for testing non-contact pads of a semiconductor device to be tested
Grant 8,253,431 - Lai , et al. August 28, 2		2012-08-28
Semiconductor device package having a jumper chip and method of fabricating the same
Grant 8,222,726 - Chang , et al. July 17, 2		2012-07-17
Semiconductor device package
Grant 8,222,733 - Cheng , et al. July 17, 2		2012-07-17
Semiconductor Package Having Proximity Communication Signal Input Terminals And Manufacturing Methods Thereof
App 20120153489 - LAI; YI-SHAO ;   et al.		2012-06-21
Advanced Quad Flat Non-leaded Package Structure And Manufacturing Method Thereof
App 20120119342 - Chang Chien; Pao-Huei ;   et al.		2012-05-17
Semiconductor Package And Method For Making The Same
App 20120091575 - Lai; Yi-Shao ;   et al.		2012-04-19
Semiconductor Package And Method For Making The Same
App 20120049360 - Lai; Yi-Shao ;   et al.		2012-03-01
Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof
Grant 8,115,285 - Chen , et al. February 14, 2		2012-02-14
Wafer and semiconductor package
Grant 8,110,931 - Chang , et al. February 7, 2		2012-02-07
Semiconductor Package And Method For Making The Same
App 20110309516 - Lai; Yi-Shao ;   et al.		2011-12-22
Semiconductor package and method for packaging a semiconductor package
Grant 8,076,786 - Hung , et al. December 13, 2		2011-12-13
Semiconductor Package
App 20110298139 - Lai; Yi-Shao ;   et al.		2011-12-08
Semiconductor package and method for making the same
Grant 8,072,064 - Lai , et al. December 6, 2		2011-12-06
Apparatus and Method for Testing Non-Contact Pads of a Semiconductor Device to be Tested
App 20110291690 - Lai; Yi-Shao ;   et al.		2011-12-01
Semiconductor Package
App 20110278739 - Lai; Yi-Shao ;   et al.		2011-11-17
Semiconductor package and method for processing and bonding a wire
Grant 8,053,906 - Chang , et al. November 8, 2		2011-11-08
Semiconductor Device Package And Method Of Fabricating The Same
App 20110233749 - CHANG; Hsiao-Chuan ;   et al.		2011-09-29
Semiconductor Device Package And Method Of Fabricating The Same
App 20110233764 - CHANG; Hsiao-Chuan ;   et al.		2011-09-29
Semiconductor Device Package And Method Of Fabricating The Same
App 20110227212 - CHENG; Ming-Hsiang ;   et al.		2011-09-22
Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package
Grant 8,018,075 - Chang , et al. September 13, 2		2011-09-13
Bonding strength measuring device
Grant 7,980,757 - Lai , et al. July 19, 2		2011-07-19
Semiconductor Package
App 20110156243 - CHANG; Hsiao-Chuan ;   et al.		2011-06-30
Test Kit For Testing A Chip Subassembly And A Testing Method By Using The Same
App 20110156739 - CHANG; Hsiao-Chuan ;   et al.		2011-06-30
Tenon-and-mortise packaging structure
Grant 7,964,949 - Lai , et al. June 21, 2		2011-06-21
Chip structure and stacked chip package as well as method for manufacturing chip structures
Grant 7,955,897 - Tsai , et al. June 7, 2		2011-06-07
Wafer And Semiconductor Package
App 20100007004 - CHANG; Hsiao Chuan ;   et al.		2010-01-14
Semiconductor Package And Method For Packaging A Semiconductor Package
App 20100007011 - HUNG; Chang Ying ;   et al.		2010-01-14
Semiconductor Package And Method For Processing And Bonding A Wire
App 20100007009 - CHANG; Hsiao Chuan ;   et al.		2010-01-14
Semiconductor Package, Method For Enhancing The Bond Of A Bonding Wire, And Method For Manufacturing A Semiconductor Package
App 20100007010 - CHANG; Hsiao Chuan ;   et al.		2010-01-14
Chip Structure And Stacked Chip Package As Well As Method For Manufacturing Chip Structures
App 20090230564 - TSAI; Tsung Yueh ;   et al.		2009-09-17
Advanced Quad Flat No Lead Chip Package Having A Protective Layer To Enhance Surface Mounting And Manufacturing Methods Thereof
App 20090230526 - Chen; Chien-Wen ;   et al.		2009-09-17
Bonding Strength Measuring Device
App 20090175312 - Lai; Yi-Shao ;   et al.		2009-07-09
Tenon-and-mortise packaging structure
App 20090096077 - Lai; Yi-Shao ;   et al.		2009-04-16
Package structure and manufacturing method thereof
App 20090051048 - Lai; Yi-Shao ;   et al.		2009-02-26
Package structure and manufacturing method thereof
App 20090051031 - Lai; Yi-Shao ;   et al.		2009-02-26
Chip packaging process
Grant 7,482,204 - Kao , et al. January 27, 2		2009-01-27
Tensile test method
Grant 7,444,884 - Lai November 4, 2		2008-11-04
Chip Packaging Process
App 20080096325 - Kao; Chin-Li ;   et al.		2008-04-24
Chip package structure and chip packaging process
Grant 7,335,982 - Kao , et al. February 26, 2		2008-02-26
Bonding strength testing device
Grant 7,329,900 - Yeh , et al. February 12, 2		2008-02-12
Tensile Test Method
App 20080011097 - Lai; Yi-Shao		2008-01-17
Stacked Chip Package
App 20070284756 - TSAI; Tsung Yueh ;   et al.		2007-12-13
Chip Structure And Chip Manufacturing Process
App 20070145604 - Kao; Chin-Li ;   et al.		2007-06-28
Bonding Strength Testing Device
App 20060231834 - Yeh; Chang-Lin ;   et al.		2006-10-19
Tensile Test Fixture And Tensile Test Method
App 20060117865 - Lai; Yi-Shao		2006-06-08
Asymmetric bump structure
App 20050263883 - Wang, Tong-Hong ;   et al.		2005-12-01
Chip Package Structure And Chip Packaging Process
App 20050224956 - Kao, Chin-Li ;   et al.		2005-10-13
Chip Package Structure
App 20050224936 - Wu, Jeng-Dah ;   et al.		2005-10-13

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