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Package And Package-on-package Structure Having Elliptical Columns And Ellipsoid Joint Terminals
App 20220301964 - Chiu; Sheng-Huan ; et al. | 2022-09-22 |
LTHC as charging barrier in InFO package formation
Grant 11,437,361 - Lai , et al. September 6, 2 | 2022-09-06 |
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
Grant 11,404,341 - Chiu , et al. August 2, 2 | 2022-08-02 |
Package On Package Structure
App 20220173083 - Shen; Dong-Han ; et al. | 2022-06-02 |
Package on package structure
Grant 11,257,797 - Shen , et al. February 22, 2 | 2022-02-22 |
Semiconductor device structure and manufacturing method
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Semiconductor package, package on package structure and method of froming package on package structure
Grant 11,201,142 - Huang , et al. December 14, 2 | 2021-12-14 |
Method for forming bump structure
Grant 11,145,613 - Lee , et al. October 12, 2 | 2021-10-12 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,867,976 - Chen , et al. December 15, 2 | 2020-12-15 |
Method Of Forming Conductive Bumps For Cooling Device Connection And Semiconductor Device
App 20200258814 - A1 | 2020-08-13 |
Package, Package-on-package Structure, And Method Of Manufacturing Package-on-package Structure
App 20200194326 - Chiu; Sheng-Huan ; et al. | 2020-06-18 |
Method of forming conductive bumps for cooling device connection
Grant 10,651,111 - Chou , et al. | 2020-05-12 |
Semiconductor Packages Having Dummy Connectors and Methods of Forming Same
App 20200118984 - Chen; Chen-Shien ; et al. | 2020-04-16 |
Package On Package Structure
App 20200091122 - Shen; Dong-Han ; et al. | 2020-03-19 |
Package and package-on-package structure having elliptical conductive columns
Grant 10,573,573 - Chiu , et al. Feb | 2020-02-25 |
Package on package structure
Grant 10,546,845 - Shen , et al. Ja | 2020-01-28 |
LTHC as Charging Barrier in InFO Package Formation
App 20200006312 - Lai; Yi-Jen ; et al. | 2020-01-02 |
LTHC as charging barrier in InFO package formation
Grant 10,522,526 - Lai , et al. Dec | 2019-12-31 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,510,734 - Chen , et al. Dec | 2019-12-17 |
Package On Package Structure
App 20190326264 - Shen; Dong-Han ; et al. | 2019-10-24 |
Package, Package-on-package Structure, And Method Of Manufacturing Package-on-package Structure
App 20190295913 - Chiu; Sheng-Huan ; et al. | 2019-09-26 |
Stacked semiconductor device and method of manufacturing the same
Grant 10,290,590 - Jeng , et al. | 2019-05-14 |
Semiconductor Device Structure and Manufacturing Method
App 20190131264 - Lee; Li-Guo ; et al. | 2019-05-02 |
Semiconductor packages having dummy connectors and methods of forming same
Grant 10,276,548 - Chen , et al. | 2019-04-30 |
Semiconductor Packages having Dummy Connectors and Methods of Forming Same
App 20190115326 - Chen; Chen-Shien ; et al. | 2019-04-18 |
LTHC as Charging Barrier in InFO Package Formation
App 20190035774 - Lai; Yi-Jen ; et al. | 2019-01-31 |
Semicondcutor Package, Package On Package Structure And Method Of Froming Package On Package Structure
App 20190035772 - Huang; Li-Hsien ; et al. | 2019-01-31 |
Method For Forming Bump Structure
App 20190019772 - LEE; Li-Guo ; et al. | 2019-01-17 |
Semiconductor device structure and manufacturing method
Grant 10,163,843 - Lee , et al. Dec | 2018-12-25 |
Bump structure and method for forming the same
Grant 10,090,267 - Lee , et al. October 2, 2 | 2018-10-02 |
Method Of Forming Conductive Bumps For Cooling Device Connection
App 20180166361 - CHOU; You-Hua ; et al. | 2018-06-14 |
Solder stud structure
Grant 9,997,482 - Lee , et al. June 12, 2 | 2018-06-12 |
Stacked Semiconductor Device And Method Of Manufacturing The Same
App 20180151512 - JENG; SHIN-PUU ; et al. | 2018-05-31 |
Semiconductor Packages having Dummy Connectors and Methods of Forming Same
App 20180076184 - Chen; Chen-Shien ; et al. | 2018-03-15 |
Semiconductor Device Structure And Manufacturing Method
App 20180068967 - Lee; Li-Guo ; et al. | 2018-03-08 |
Method of forming conductive bumps for cooling device connection
Grant 9,899,296 - Chou , et al. February 20, 2 | 2018-02-20 |
Method For Forming Bump Structure
App 20180033756 - LEE; Li-Guo ; et al. | 2018-02-01 |
Semiconductor device structure and manufacturing method
Grant 9,806,046 - Lee , et al. October 31, 2 | 2017-10-31 |
Package structure and manufacturing method
Grant 9,779,969 - Lee , et al. October 3, 2 | 2017-10-03 |
Semiconductor device structure and manufacturing method
Grant 9,735,123 - Lee , et al. August 15, 2 | 2017-08-15 |
Probe card for simultaneously testing multiple dies
Grant 9,594,096 - Chou , et al. March 14, 2 | 2017-03-14 |
Die edge contacts for semiconductor devices
Grant 9,190,347 - Lai , et al. November 17, 2 | 2015-11-17 |
Bump Structure And Method For Forming The Same
App 20150262951 - LEE; Li-Guo ; et al. | 2015-09-17 |
Semiconductor Device Structure And Manufacturing Method
App 20150262953 - LEE; Li-Guo ; et al. | 2015-09-17 |
Solder Stud Structure And Method Of Fabricating The Same
App 20150262954 - LEE; Li-Guo ; et al. | 2015-09-17 |
Semiconductor Device Structure And Manufacturing Method
App 20150262955 - LEE; Li-Guo ; et al. | 2015-09-17 |
Bump Structure And Method For Forming The Same
App 20150262952 - LEE; Li-Guo ; et al. | 2015-09-17 |
Package Structure And Manufacturing Method
App 20150262846 - LEE; Li-Guo ; et al. | 2015-09-17 |
Metal Bumps For Cooling Device Connection
App 20150125998 - CHOU; You-Hua ; et al. | 2015-05-07 |
Semiconductor device and semiconductor assembly with lead-free solder
Grant 8,952,534 - Lai , et al. February 10, 2 | 2015-02-10 |
Metal bumps for cooling device connection
Grant 8,941,232 - Chou , et al. January 27, 2 | 2015-01-27 |
Semiconductor devices, packaging methods and structures
Grant 8,916,969 - Chen , et al. December 23, 2 | 2014-12-23 |
Semiconductor Device And Semiconductor Assembly With Lead-free Solder
App 20140070409 - LAI; Yi-Jen ; et al. | 2014-03-13 |
Semiconductor device and semiconductor assembly with lead-free solder
Grant 8,610,270 - Lai , et al. December 17, 2 | 2013-12-17 |
Die Edge Contacts for Semiconductor Devices
App 20130328215 - Lai; Yi-Jen ; et al. | 2013-12-12 |
Probe Card for Simultaneously Testing Multiple Dies
App 20130328586 - Chou; You-Hua ; et al. | 2013-12-12 |
Probe card for simultaneously testing multiple dies
Grant 8,564,319 - Chou , et al. October 22, 2 | 2013-10-22 |
Die edge contacts for semiconductor devices
Grant 8,541,262 - Lai , et al. September 24, 2 | 2013-09-24 |
Semiconductor Devices, Packaging Methods and Structures
App 20130026623 - Chen; Yu-Ren ; et al. | 2013-01-31 |
Metal Bumps For Cooling Device Connection
App 20120217628 - CHOU; You-Hua ; et al. | 2012-08-30 |
Die Edge Contacts for Semiconductor Devices
App 20120056328 - Lai; Yi-Jen ; et al. | 2012-03-08 |
Probe Card for Simultaneously Testing Multiple Dies
App 20110309854 - Chou; You-Hua ; et al. | 2011-12-22 |
Semiconductor Device And Semiconductor Assembly With Lead-free Solder
App 20110193219 - LAI; Yi-Jen ; et al. | 2011-08-11 |
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