Lai; Yi-Che
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Yi-Che.The latest application filed is for "substrate structure".
Company Profile
1.23.36
- Lai; Yi-Che - Taichung TW
- Lai; Yi-Che - Taichung Hsien TW
Patent Activity
| Patent | Date |
|---|---|
| Substrate structure Grant 10,199,341 - Liang , et al. Fe | 2019-02-05 |
| Packaging substrate and electronic package having the same Grant 10,062,651 - Liang , et al. August 28, 2 | 2018-08-28 |
| Substrate structure Grant 10,049,975 - Liang , et al. August 14, 2 | 2018-08-14 |
| Semiconductor package and method of fabricating the same Grant 9,899,308 - Tseng , et al. February 20, 2 | 2018-02-20 |
| Semiconductor device having conductive vias Grant 9,875,981 - Lee , et al. January 23, 2 | 2018-01-23 |
| Substrate Structure App 20170317040 - Liang; Fang-Yu ; et al. | 2017-11-02 |
| Electronic Package And Substrate Structure Thereof App 20170311445 - Chang; Hung-Hsien ; et al. | 2017-10-26 |
| Semiconductor package and fabrication method thereof Grant 9,754,898 - Chan , et al. September 5, 2 | 2017-09-05 |
| Package Structure App 20170236783 - Liu; Yi-Wei ; et al. | 2017-08-17 |
| Semiconductor Package And Method Of Fabricating The Same App 20170229387 - Tseng; Wen-Tsung ; et al. | 2017-08-10 |
| Substrate Structure App 20170229386 - Liang; Fang-Yu ; et al. | 2017-08-10 |
| Method of fabricating a semiconductor package Grant 9,720,013 - Huang , et al. August 1, 2 | 2017-08-01 |
| Packaging Substrate And Electronic Package Having The Same App 20170186702 - Liang; Fang-Yu ; et al. | 2017-06-29 |
| Package structure and fabrication method thereof Grant 9,666,536 - Liu , et al. May 30, 2 | 2017-05-30 |
| Method Of Fabricating Semiconductor Package App 20170148761 - Ma; Guang-Hwa ; et al. | 2017-05-25 |
| Fabrication method of semiconductor package Grant 9,627,226 - Lin , et al. April 18, 2 | 2017-04-18 |
| Semiconductor package and method of fabricating the same Grant 9,607,939 - Tseng , et al. March 28, 2 | 2017-03-28 |
| Package structure and fabrication method thereof Grant 9,607,974 - Lin , et al. March 28, 2 | 2017-03-28 |
| Electronic Package And Fabrication Method Thereof App 20170053859 - Liang; Fang-Yu ; et al. | 2017-02-23 |
| Semiconductor Device Having Conductive Vias App 20170040277 - Lee; Meng-Tsung ; et al. | 2017-02-09 |
| Method of fabricating semiconductor package having an interposer structure Grant 9,548,220 - Chuang , et al. January 17, 2 | 2017-01-17 |
| Semiconductor package and fabrication method thereof Grant 9,520,304 - Chang , et al. December 13, 2 | 2016-12-13 |
| Semiconductor device having conductive vias Grant 9,502,333 - Lee , et al. November 22, 2 | 2016-11-22 |
| Method of fabricating semiconductor package Grant 9,418,874 - Chen , et al. August 16, 2 | 2016-08-16 |
| Fabrication Method Of Semiconductor Package App 20160204093 - Lin; Chun-Tang ; et al. | 2016-07-14 |
| Package Structure And Fabrication Method Thereof App 20160190099 - Liu; Yi-Wei ; et al. | 2016-06-30 |
| Method of fabricating a semiconductor structure having conductive bumps with a plurality of metal layers Grant 9,349,705 - Chan , et al. May 24, 2 | 2016-05-24 |
| Package Structure And Fabrication Method Thereof App 20160141227 - Lin; Chun-Tang ; et al. | 2016-05-19 |
| Method Of Fabricating Semiconductor Package Having An Interposer Structure App 20160118271 - Chuang; Kuan-Wei ; et al. | 2016-04-28 |
| Semiconductor package and fabrication method thereof Grant 9,324,582 - Lin , et al. April 26, 2 | 2016-04-26 |
| Fabrication method of semiconductor package Grant 9,269,693 - Chan , et al. February 23, 2 | 2016-02-23 |
| Semiconductor package, and interposer structure of the semiconductor package Grant 9,257,381 - Chuang , et al. February 9, 2 | 2016-02-09 |
| Method Of Fabricating Semiconductor Package App 20150255311 - Chen; Wan-Ting ; et al. | 2015-09-10 |
| Semiconductor package and method of fabricating the same Grant 9,087,780 - Chen , et al. July 21, 2 | 2015-07-21 |
| Method Of Fabricating A Semiconductor Structure Having Conductive Bumps With A Plurality Of Metal Layers App 20150155258 - Chan; Chien-Feng ; et al. | 2015-06-04 |
| Fabrication Method Of Semiconductor Package App 20150132893 - Chan; Chien-Feng ; et al. | 2015-05-14 |
| Method of testing a semiconductor package Grant 8,987,012 - Huang , et al. March 24, 2 | 2015-03-24 |
| Semiconductor Package And Method Of Fabricating The Same App 20150069628 - Tseng; Wen-Tsung ; et al. | 2015-03-12 |
| Semiconductor Package And Fabrication Method Thereof App 20150041969 - Chang; Hong-Da ; et al. | 2015-02-12 |
| Semiconductor package and fabrication method thereof Grant 8,952,528 - Chan , et al. February 10, 2 | 2015-02-10 |
| Conductive bump structure with a plurality of metal layers Grant 8,952,537 - Chan , et al. February 10, 2 | 2015-02-10 |
| Semiconductor Package And Method Of Fabricating The Same App 20150035163 - Ma; Guang-Hwa ; et al. | 2015-02-05 |
| Semiconductor Package And Method Of Fabricating The Same App 20150035164 - Ma; Guang-Hwa ; et al. | 2015-02-05 |
| Semiconductor Package And Method Of Fabricating The Same App 20150014864 - Chen; Wan-Ting ; et al. | 2015-01-15 |
| Semiconductor Package And Fabrication Method Thereof App 20140264928 - Lin; Chun-Tang ; et al. | 2014-09-18 |
| Semiconductor Device Having A Conductive Vias App 20140252603 - Lee; Meng-Tsung ; et al. | 2014-09-11 |
| Semiconductor Package And Fabrication Method Thereof App 20140191386 - Lee; Mei-Chin ; et al. | 2014-07-10 |
| Semiconductor Package And Fabrication Method Thereof App 20140138791 - Chan; Chien-Feng ; et al. | 2014-05-22 |
| Method Of Testing A Semiconductor Package App 20140127838 - Huang; Pin-Cheng ; et al. | 2014-05-08 |
| Method Of Fabricating A Semiconductor Package App 20140127864 - Chuang; Kuan-Wei ; et al. | 2014-05-08 |
| Method Of Testing A Semiconductor Structure App 20140118019 - Huang; Pin-Cheng ; et al. | 2014-05-01 |
| Semiconductor Package And Fabrication Method Thereof App 20140084484 - Chan; Mu-Hsuan ; et al. | 2014-03-27 |
| Semiconductor Package And Fabrication Method Thereof App 20140077387 - Chuang; Kuan-Wei ; et al. | 2014-03-20 |
| Semiconductor Package, Method Of Fabricating The Semiconductor Package, And Interposer Structure Of The Semiconductor Package App 20140070424 - Chuang; Kuan-Wei ; et al. | 2014-03-13 |
| Method Of Fabricating A Semiconductor Package App 20140073087 - Huang; Pin-Cheng ; et al. | 2014-03-13 |
| Semiconductor Package And Method Of Fabricating The Same App 20140027926 - Chen; Wang-Ting ; et al. | 2014-01-30 |
| Substrate Structure, Semiconductor Package And Methods Of Fabricating The Same App 20140008819 - Chan; Chien-Feng ; et al. | 2014-01-09 |
| Conductive Bump Structure And Method Of Fabricating A Semiconductor Structure App 20140008787 - Chan; Chien-Feng ; et al. | 2014-01-09 |
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