Lai; Wen-Lung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Wen-Lung.The latest application filed is for "packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure".
- Lai; Wen-Lung - Taoyuan TW
- Lai; Wen-Lung - Taichung TW
- Lai; Wen-Lung - Taoyuan City TW
| Patent | Date |
|---|---|
| Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure Grant 9,916,990 - Lai , et al. March 13, 2 | 2018-03-13 |
| Integrated circuit and manufacturing method thereof Grant 9,721,883 - Lai , et al. August 1, 2 | 2017-08-01 |
| Packaging Substrate Having A Holder, Method Of Fabricating The Packaging Substrate, Package Structure Having A Holder, And Method Of Fabricating The Package Structure App 20160086822 - Lai; Wen-Lung ; et al. | 2016-03-24 |
| Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure Grant 9,230,899 - Lai , et al. January 5, 2 | 2016-01-05 |
| Packaging Substrate Having A Holder, Method Of Fabricating The Packaging Substrate, Package Structure Having A Holder, And Method Of Fabricating The Package Structure App 20130083503 - Lai; Wen-Lung ; et al. | 2013-04-04 |
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