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Lai; Wei-An Patent Filings

Lai; Wei-An

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Wei-An.The latest application filed is for "variable width nano-sheet field-effect transistor cell structure".

Company Profile
9.9.22
  • Lai; Wei-An - Taichung TW
  • LAI; Wei-An - Hsinchu TW
  • Lai; Wei-An - Taichung City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Variable Width Nano-sheet Field-effect Transistor Cell Structure
App 20220292244 - Lai; Wei-An ;   et al.
2022-09-15
Variable width nano-sheet field-effect transistor cell structure
Grant 11,429,774 - Lai , et al. August 30, 2
2022-08-30
Deep Lines And Shallow Lines In Signal Conducting Paths
App 20220262719 - LAI; Wei-An ;   et al.
2022-08-18
Backside Conducting Lines In Integrated Circuits
App 20220254770 - LAI; Wei-An ;   et al.
2022-08-11
Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of same
Grant 11,409,937 - Lin , et al. August 9, 2
2022-08-09
Semiconductor Devices And Methods Of Manufacturing Thereof
App 20220238679 - Chiu; Te-Hsin ;   et al.
2022-07-28
Semiconductor Devices And Methods Of Manufacturing Thereof
App 20220238371 - Chiu; Te-Hsin ;   et al.
2022-07-28
Layout designs of integrated circuits having backside routing tracks
Grant 11,355,487 - Lai , et al. June 7, 2
2022-06-07
Backside Signal Interconnection
App 20220130759 - Huang; Yu-Xuan ;   et al.
2022-04-28
Memory Device And Layout, Manufacturing Method Of The Same
App 20220122993 - Chiu; Te-Hsin ;   et al.
2022-04-21
Semiconductor Device And Manufacturing Method Thereof
App 20220068791 - CHIU; Te-Hsin ;   et al.
2022-03-03
Layout Designs Of Integrated Circuits Having Backside Routing Tracks
App 20220020738 - LAI; Wei-An ;   et al.
2022-01-20
Integrated Circuit, System And Method Of Forming The Same
App 20210343744 - CHIU; Te-Hsin ;   et al.
2021-11-04
Semiconductor Devices
App 20210313263 - LAI; WEI-AN ;   et al.
2021-10-07
Hybrid power rail structure
Grant 11,133,254 - Lai , et al. September 28, 2
2021-09-28
Local Interconnect Structure
App 20210280607 - CHEN; Chih-Liang ;   et al.
2021-09-09
Multiple Fin Height Integrated Circuit
App 20210217744 - LIN; Wei-Cheng ;   et al.
2021-07-15
Local interconnect structure
Grant 11,018,157 - Chen , et al. May 25, 2
2021-05-25
Semiconductor Device Including Cell Region Having More Similar Cell Densities In Different Height Rows, And Method And System For Generating Layout Diagram Of Same
App 20210110094 - LIN; Wei-Cheng ;   et al.
2021-04-15
Multiple fin height integrated circuit
Grant 10,964,684 - Lin , et al. March 30, 2
2021-03-30
Hybrid Fin Field-Effect Transistor Cell Structures and Related Methods
App 20210005633 - Lai; Wei-An ;   et al.
2021-01-07
Hybrid Fin Field-Effect Transistor Cell Structures and Related Methods
App 20210005634 - Lai; Wei-An ;   et al.
2021-01-07
Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of same
Grant 10,878,158 - Lin , et al. December 29, 2
2020-12-29
Hybrid fin field-effect transistor cell structures and related methods
Grant 10,797,078 - Lai , et al. October 6, 2
2020-10-06
Hybrid Power Rail Structure
App 20200105671 - LAI; Wei-An ;   et al.
2020-04-02
Hybrid Fin Field-Effect Transistor Cell Structures and Related Methods
App 20200058681 - Lai; Wei-An ;   et al.
2020-02-20
Semiconductor Device Including Cell Region Having Mor Similar Cell Densities In Different Height Rows, And Method And System For
App 20200019667 - LIN; Wei-Cheng ;   et al.
2020-01-16
Multiple Fin Height Integrated Circuit
App 20200006318 - LIN; Wei-Cheng ;   et al.
2020-01-02
Local Interconnect Structure
App 20190096909 - Chen; Chih-Liang ;   et al.
2019-03-28
Memory utilizing bundle-level status values and bundle status circuits
Grant 9,478,314 - Lu , et al. October 25, 2
2016-10-25
Memory Utilizing Bundle-level Status Values And Bundle Status Circuits
App 20160077153 - LU; HUNGWEI ;   et al.
2016-03-17

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