Lai; Siaw Kang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Siaw Kang.The latest application filed is for "methods and apparatus for managing thermal behavior in multichip packages".

Company Profile

1.8.5

Lai; Siaw Kang - Penang MY
Lai; Siaw Kang - Gelugor MY
Lai; Siaw-Kang - Singapore SG
Lai; Siaw-Kang - Sarawak MY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods and apparatus for managing thermal behavior in multichip packages Grant 11,164,847 - Sethuraman , et al. November 2, 2	2021-11-02
Methods And Apparatus For Managing Thermal Behavior In Multichip Packages App 20200105722 - Sethuraman; Saravanan ; et al.	2020-04-02
Apparatus and method to reduce memory subsystem power dynamically Grant 10,416,910 - Lai Sept	2019-09-17
Providing a fine-grained arbitration system Grant 9,390,039 - Lai July 12, 2	2016-07-12
Providing A Fine-Grained Arbitration System App 20140149620 - Lai; Siaw Kang	2014-05-29
Providing a fine-grained arbitration system Grant 8,667,197 - Lai March 4, 2	2014-03-04
Method of improving operational speed of encryption engine Grant 8,526,601 - Garg , et al. September 3, 2	2013-09-03
Providing A Fine-grained Arbitration System App 20120059962 - Lai; Siaw Kang	2012-03-08
Fast add rotate add operation Grant 7,395,306 - Lai , et al. July 1, 2	2008-07-01
Method of improving operational speed of encryption engine App 20050226409 - Garg, Atul ; et al.	2005-10-13

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