Lai; Min-Tih Ted
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Min-Tih Ted.The latest application filed is for "die stack with cascade and vertical connections".
- Lai; Min-Tih Ted - Folsom CA
| Patent | Date |
|---|---|
| Die Stack With Cascade And Vertical Connections App 20220037291 - Lai; Min-Tih Ted ; et al. | 2022-02-03 |
| Die stack with cascade and vertical connections Grant 11,171,114 - Lai , et al. November 9, 2 | 2021-11-09 |
| Post-grind die backside power delivery Grant 10,910,301 - Lai , et al. February 2, 2 | 2021-02-02 |
| Compact wirebonding in stacked-chip system in package, and methods of making same Grant 10,847,450 - Shojaie , et al. November 24, 2 | 2020-11-24 |
| Post-grind Die Backside Power Delivery App 20200051903 - Lai; Min-Tih Ted ; et al. | 2020-02-13 |
| Post-grind die backside power delivery Grant 10,483,198 - Lai , et al. Nov | 2019-11-19 |
| Compact Wirebonding In Stacked-chip System In Package, And Methods Of Making Same App 20190181072 - SHOJAIE; Saeed ; et al. | 2019-06-13 |
| Die Stack With Cascade And Vertical Connections App 20180366441 - Lai; Min-Tih Ted ; et al. | 2018-12-20 |
| Post-grind Die Backside Power Delivery App 20180315699 - Lai; Min-Tih Ted ; et al. | 2018-11-01 |
| Post-grind die backside power delivery Grant 10,032,707 - Lai , et al. July 24, 2 | 2018-07-24 |
| Post-grind Die Backside Power Delivery App 20180182699 - Lai; Min-Tih Ted ; et al. | 2018-06-28 |
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