Lai; Lee Wang

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Lee Wang.The latest application filed is for "stacked die package for peripheral and center device pad layout device".

Company Profile

0.7.7

Lai; Lee Wang - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked die package for peripheral and center device pad layout device Grant 8,269,328 - Kim , et al. September 18, 2	2012-09-18
Stacked Die Package For Peripheral And Center Device Pad Layout Device App 20110062583 - Kim; Dalson Ye Seng ; et al.	2011-03-17
Stacked die package for peripheral and center device pad layout device Grant 7,846,768 - Kim , et al. December 7, 2	2010-12-07
Stacked Die Package For Peripheral And Center Device Pad Layout Device App 20080280396 - Kim; Dalson Ye Seng ; et al.	2008-11-13
Stacked die package for peripheral and center device pad layout device Grant 7,425,463 - Kim , et al. September 16, 2	2008-09-16
Stacked device package for peripheral and center device pad layout device Grant 7,205,656 - Kim , et al. April 17, 2	2007-04-17
Stacked die package for peripheral and center device pad layout device App 20060246622 - Kim; Dalson Ye Seng ; et al.	2006-11-02
Stacked device package for peripheral and center device pad layout device App 20060197206 - Kim; Dalson Ye Seng ; et al.	2006-09-07
Method for fabricating a semiconductor package with multi layered leadframe Grant 6,972,214 - Kuan , et al. December 6, 2	2005-12-06
Method for fabricating a semiconductor package with multi layered leadframe App 20050087847 - Kuan, Lee Choon ; et al.	2005-04-28
Method for fabricating semiconductor component with multi layered leadframe Grant 6,835,599 - Kuan , et al. December 28, 2	2004-12-28
Semiconductor component having multi layered leadframe Grant 6,784,525 - Kuan , et al. August 31, 2	2004-08-31
Method for fabricating semiconductor component with multi layered leadframe App 20040130010 - Kuan, Lee Choon ; et al.	2004-07-08
Semiconductor package having multi-layer leadframe and method of fabrication App 20040080046 - Choon Kuan, Lee ; et al.	2004-04-29

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