loadpatents
name:-0.0061490535736084
name:-0.0076429843902588
name:-0.00057601928710938
Lai; Kwok Fai Patent Filings

Lai; Kwok Fai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Kwok Fai.The latest application filed is for "collaboration environments that support offline edits of shared documents".

Company Profile
0.5.5
  • Lai; Kwok Fai - Hong Kong CN
  • Lai; Kwok Fai - Kowloon HK
  • Lai; Kwok Fai - Pal Alto CA
  • Lai; Kwok Fai - Palo Alto CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Collaboration environments that support offline edits of shared documents
Grant 11,455,345 - Underwood , et al. September 27, 2
2022-09-27
Collaboration Environments That Support Offline Edits Of Shared Documents
App 20210133253 - Underwood; David A. ;   et al.
2021-05-06
Multiport RJ connector
Grant 7,717,749 - Chen , et al. May 18, 2
2010-05-18
Moving Interleaved Sputter Chamber Shields
App 20080264340 - Martinson; Robert ;   et al.
2008-10-30
Apparatus and method for depositing superior Ta (N) copper thin films for barrier and seed applications in semiconductor processing
Grant 6,905,959 - Ashtiani , et al. June 14, 2
2005-06-14
Multiport RJ connector
App 20050059295 - Chen, John ;   et al.
2005-03-17
Multiport RJ connector
App 20030022553 - Chen, John ;   et al.
2003-01-30
PVD deposition of titanium and titanium nitride layers in the same chamber without use of a collimator or a shutter
Grant 6,342,133 - D'Couto , et al. January 29, 2
2002-01-29
PVD deposition of titanium and titanium nitride layers in the same chamber without use of a collimator or a shutter
App 20010030125 - D'Couto, Gerard Chris ;   et al.
2001-10-18
Apparatus and method for controlling erosion profile in hollow cathode magnetron sputter source
Grant 6,193,854 - Lai , et al. February 27, 2
2001-02-27

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