Lai; Kwan-Yu
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Kwan-Yu.The latest application filed is for "wafer reconstitution and die-stitching".
Company Profile
3.17.27
- Lai; Kwan-Yu - Campbell CA
- Lai; Kwan-Yu - San Jose CA
- Lai; Kwan-Yu - Cupertino CA
Patent Activity
| Patent | Date |
|---|---|
| Wafer Reconstitution And Die-stitching App 20220013504 - Dabral; Sanjay ; et al. | 2022-01-13 |
| Wafer reconstitution and die-stitching Grant 11,158,607 - Dabral , et al. October 26, 2 | 2021-10-26 |
| 3D fanout stacking Grant 11,056,373 - Zhai , et al. July 6, 2 | 2021-07-06 |
| Wafer Reconstitution And Die-stitching App 20200176419 - Dabral; Sanjay ; et al. | 2020-06-04 |
| Integrated Magnetic Passive Devices Using Magnetic Film App 20190051449 - Cappabianca; David P. ; et al. | 2019-02-14 |
| Embedded thin film magnetic carrier for integrated voltage regulator Grant 10,199,152 - Erturk , et al. Fe | 2019-02-05 |
| Incorporation of passives and fine pitch through via for package on package Grant 10,115,671 - Shenoy , et al. October 30, 2 | 2018-10-30 |
| Integrated magnetic passive devices using magnetic film Grant 10,102,962 - Cappabianca , et al. October 16, 2 | 2018-10-16 |
| Carrier Ultra Thin Substrate App 20180082858 - Hsu; Jun Chung ; et al. | 2018-03-22 |
| Carrier ultra thin substrate Grant 9,899,239 - Hsu , et al. February 20, 2 | 2018-02-20 |
| High quality factor capacitors and methods for fabricating high quality factor capacitors Grant 9,773,862 - Yun , et al. September 26, 2 | 2017-09-26 |
| Finger biometric sensor assembly including direct bonding interface and related methods Grant 9,679,187 - Bhagavat , et al. June 13, 2 | 2017-06-13 |
| Dual molded stack TSV package Grant 9,679,801 - Lai , et al. June 13, 2 | 2017-06-13 |
| Carrier Ultra Thin Substrate App 20170135219 - Hsu; Jun Chung ; et al. | 2017-05-11 |
| High Quality Factor Capacitors And Methods For Fabricating High Quality Factor Capacitors App 20170125512 - YUN; Changhan Hobie ; et al. | 2017-05-04 |
| System in package fan out stacking architecture and process flow Grant 9,633,974 - Zhai , et al. April 25, 2 | 2017-04-25 |
| Independent 3d Stacking App 20170053897 - Lai; Kwan-Yu ; et al. | 2017-02-23 |
| Independent 3D stacking Grant 9,559,081 - Lai , et al. January 31, 2 | 2017-01-31 |
| 3d Fanout Stacking App 20170025380 - Zhai; Jun ; et al. | 2017-01-26 |
| High quality factor capacitors and methods for fabricating high quality factor capacitors Grant 9,548,350 - Yun , et al. January 17, 2 | 2017-01-17 |
| Finger Biometric Sensor Assembly Including Direct Bonding Interface And Related Methods App 20160371529 - Bhagavat; Milind S. ; et al. | 2016-12-22 |
| Dual Molded Stack Tsv Package App 20160358889 - Lai; Kwan-Yu ; et al. | 2016-12-08 |
| Integrated interposer with embedded active devices Grant 9,510,454 - Ramachandran , et al. November 29, 2 | 2016-11-29 |
| Mechanical Handling Support For Thin Cores Using Photo-patternable Material App 20160315024 - LAI; Kwan-yu ; et al. | 2016-10-27 |
| System In Package Fan Out Stacking Architecture And Process Flow App 20160260684 - Zhai; Jun ; et al. | 2016-09-08 |
| Embedded Thin Film Magnetic Carrier For Integrated Voltage Regulator App 20160163443 - ERTURK; Mete ; et al. | 2016-06-09 |
| Electro-optical transceiver device to enable chip-to-chip interconnection Grant 9,325,420 - Lai , et al. April 26, 2 | 2016-04-26 |
| Integration of a coil and a discontinuous magnetic core Grant 9,293,245 - Stephanou , et al. March 22, 2 | 2016-03-22 |
| Semiconductor device with via bar Grant 9,263,370 - Shenoy , et al. February 16, 2 | 2016-02-16 |
| Electro-optical Transceiver Device To Enable Chip-to-chip Interconnection App 20150333831 - Lai; Kwan-yu ; et al. | 2015-11-19 |
| Metal-insulator-metal capacitors on glass substrates Grant 9,190,208 - Lasiter , et al. November 17, 2 | 2015-11-17 |
| Landside Embedded Inductor For Fanout Packaging App 20150311271 - ERTURK; Mete ; et al. | 2015-10-29 |
| Integrated Interposer With Embedded Active Devices App 20150250058 - RAMACHANDRAN; Vidhya ; et al. | 2015-09-03 |
| High Quality Factor Capacitors And Methods For Fabricating High Quality Factor Capacitors App 20150228712 - YUN; Changhan Hobie ; et al. | 2015-08-13 |
| Semiconductor Device With Via Bar App 20150091179 - SHENOY; Ravindra Vaman ; et al. | 2015-04-02 |
| Metal-insulator-metal Capacitors On Glass Substrates App 20150041189 - Lasiter; Jon Bradley ; et al. | 2015-02-12 |
| Integration Of A Coil And A Discontinuous Magnetic Core App 20150035638 - Stephanou; Philip Jason ; et al. | 2015-02-05 |
| Laser Encapsulation Of Multiple Dissimilar Devices On A Substrate App 20140177188 - Stephanou; Philip Jason ; et al. | 2014-06-26 |
| Adhesive Metal Nitride On Glass And Related Methods App 20140144681 - Pushparaj; Victor Louis Arockiaraj ; et al. | 2014-05-29 |
| Through Substrate Via Inductors App 20140104288 - Shenoy; Ravindra V. ; et al. | 2014-04-17 |
| Through Substrate Via Inductors App 20140104284 - Shenoy; Ravindra V. ; et al. | 2014-04-17 |
| Passives Via Bar App 20140035935 - Shenoy; Ravindra V. ; et al. | 2014-02-06 |
| Incorporation Of Passives And Fine Pitch Through Via For Package On Package App 20140035892 - Shenoy; Ravindra V. ; et al. | 2014-02-06 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 