Patent applications and USPTO patent grants for Lai; Kuo-Hua.The latest application filed is for "semiconductor package structure and method of manufacturing the same".
Patent | Date |
---|---|
Semiconductor package structure Grant 11,296,651 - Tseng , et al. April 5, 2 | 2022-04-05 |
Semiconductor Package Structure And Method Of Manufacturing The Same App 20210257988 - TSENG; Chi Sheng ;   et al. | 2021-08-19 |
Semiconductor Package Structure App 20210036658 - TSENG; Chi Sheng ;   et al. | 2021-02-04 |
Semiconductor package structure Grant 10,812,017 - Tseng , et al. October 20, 2 | 2020-10-20 |
Optical film defect detection method and system thereof Grant 9,582,872 - Hsu , et al. February 28, 2 | 2017-02-28 |
Real Time Monitoring System and Method Thereof of Optical Film Manufacturing Process App 20170003677 - HSU; Chia-Yu ;   et al. | 2017-01-05 |
Optical Film Defect Detection Method And System Thereof App 20170004612 - HSU; CHIA-YU ;   et al. | 2017-01-05 |
Driving Behavior Analysis Method And System Thereof App 20160086394 - YANG; Chin-Sheng ;   et al. | 2016-03-24 |
System And Method For Analyzing Fuel Efficiency Based On Driving Behavior App 20160082905 - HSU; Chia-Yu ;   et al. | 2016-03-24 |
Power-saving Apparatus And Method For Transportation Vehicle App 20150175003 - CHAO; KUO-SHENG ;   et al. | 2015-06-25 |
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