name:-0.010653972625732
name:-0.0045249462127686
name:-0.0042550563812256
Lai; Kuo-Hua Patent Filings

Lai; Kuo-Hua

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Kuo-Hua.The latest application filed is for "semiconductor package structure and method of manufacturing the same".

Company Profile
3.3.7
  • Lai; Kuo-Hua - Kaohsiung TW
  • Lai; Kuo-Hua - Taoyuan TW
  • LAI; Kuo-Hua - Taoyuan City TW
  • LAI; KUO-HUA - TAOYUAN COUNTY TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks
Patent Activity
PatentDate
Semiconductor package structure
Grant 11,296,651 - Tseng , et al. April 5, 2
2022-04-05
Semiconductor Package Structure And Method Of Manufacturing The Same
App 20210257988 - TSENG; Chi Sheng ;   et al.
2021-08-19
Semiconductor Package Structure
App 20210036658 - TSENG; Chi Sheng ;   et al.
2021-02-04
Semiconductor package structure
Grant 10,812,017 - Tseng , et al. October 20, 2
2020-10-20
Optical film defect detection method and system thereof
Grant 9,582,872 - Hsu , et al. February 28, 2
2017-02-28
Real Time Monitoring System and Method Thereof of Optical Film Manufacturing Process
App 20170003677 - HSU; Chia-Yu ;   et al.
2017-01-05
Optical Film Defect Detection Method And System Thereof
App 20170004612 - HSU; CHIA-YU ;   et al.
2017-01-05
Driving Behavior Analysis Method And System Thereof
App 20160086394 - YANG; Chin-Sheng ;   et al.
2016-03-24
System And Method For Analyzing Fuel Efficiency Based On Driving Behavior
App 20160082905 - HSU; Chia-Yu ;   et al.
2016-03-24
Power-saving Apparatus And Method For Transportation Vehicle
App 20150175003 - CHAO; KUO-SHENG ;   et al.
2015-06-25

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