LAI; Kun-Yu
Patent Applications and Registrations
Patent applications and USPTO patent grants for LAI; Kun-Yu.The latest application filed is for "sensing substrate, manufacturing method thereof, and sensor".
- LAI; Kun-Yu - Taoyuan City TW
- Lai; Kun-Yu - Taoyuan TW
- Lai; Kun-Yu - Kaohsiung N/A TW
- Lai; Kun-Yu - Kaohsiung City TW
- Lai; Kun-Yu - Tainan Hsien TW
| Patent | Date |
|---|---|
| Sensing Substrate, Manufacturing Method Thereof, And Sensor App 20210132419 - LAI; Kun-Yu ; et al. | 2021-05-06 |
| Sensing substrate, manufacturing method thereof, and sensor Grant 10,976,577 - Lai , et al. April 13, 2 | 2021-04-13 |
| Zinc oxide anti-reflection layer having a syringe-like structure and method for fabricating the same Grant 9,261,627 - Huang , et al. February 16, 2 | 2016-02-16 |
| Zinc Oxide Anti-reflection Layer Having A Syringe-like Structure And Method For Fabricating The Same App 20130129974 - Huang; Kun-Ping ; et al. | 2013-05-23 |
| Method for dicing a semiconductor wafer App 20070015343 - Chung; Kuan-Jen ; et al. | 2007-01-18 |
| Method for making a semiconductor light emitting device Grant 7,157,293 - Chen , et al. January 2, 2 | 2007-01-02 |
| Method for making a semiconductor light emitting device App 20060094139 - Chen; Cheng-Chuan ; et al. | 2006-05-04 |
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