Lai; Kuan-Ming
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Kuan-Ming.The latest application filed is for "composite structure of flat heat pipe and heat conduction device thereof".
- Lai; Kuan-Ming - New Taipei TW
- LAI; Kuan-Ming - NEW TAIPEI CITY TW
- Lai; Kuan-Ming - Taipei TW
| Patent | Date |
|---|---|
| Composite structure of flat heat pipe and heat conduction device thereof Grant 9,689,623 - Lai , et al. June 27, 2 | 2017-06-27 |
| Composite Structure Of Flat Heat Pipe And Heat Conduction Device Thereof App 20170131036 - LAI; Kuan-Ming ; et al. | 2017-05-11 |
| Lateral Surrounding Heat Pipe And Heat Dissipating Structure Thereof App 20170108285 - WANG; Cheng-Tu ; et al. | 2017-04-20 |
| Heat-dissipating Device Of Portable Electronic Apparatus App 20090109620 - WANG; Cheng-Tu ; et al. | 2009-04-30 |
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