LAI; Ken Kaung

Patent Applications and Registrations

Patent applications and USPTO patent grants for LAI; Ken Kaung.The latest application filed is for "method and apparatus for selective nitridation process".

Company Profile

1.19.22

LAI; Ken Kaung - San Jose CA
Lai; Ken Kaung - Milpitas CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method And Apparatus For Selective Nitridation Process App 20190088485 - ROGERS; Matthew Scott ; et al.	2019-03-21
Method and apparatus for selective nitridation process Grant 10,049,881 - Rogers , et al. August 14, 2	2018-08-14
Atomic layer deposition apparatus Grant 9,031,685 - Chin , et al. May 12, 2	2015-05-12
Atomic Layer Deposition Apparatus App 20140130739 - CHIN; Barry L. ; et al.	2014-05-15
Atomic layer deposition apparatus Grant 8,626,330 - Chin , et al. January 7, 2	2014-01-07
Method And Apparatus For Selective Nitridation Process App 20130040444 - ROGERS; MATTHEW S. ; et al.	2013-02-14
Atomic Layer Deposition Apparatus App 20120006265 - CHIN; BARRY L. ; et al.	2012-01-12
Atomic layer deposition apparatus Grant 8,027,746 - Chin , et al. September 27, 2	2011-09-27
Atomic Layer Deposition Apparatus App 20110111603 - CHIN; BARRY L. ; et al.	2011-05-12
Atomic layer deposition apparatus Grant 7,860,597 - Chin , et al. December 28, 2	2010-12-28
Methods for depositing tungsten layers employing atomic layer deposition techniques Grant 7,745,333 - Lai , et al. June 29, 2	2010-06-29
Method for depositing tungsten-containing layers by vapor deposition techniques Grant 7,709,385 - Xi , et al. May 4, 2	2010-05-04
Atomic Layer Deposition Apparatus App 20100099270 - Chin; Barry L. ; et al.	2010-04-22
Pulsed deposition process for tungsten nucleation Grant 7,695,563 - Lu , et al. April 13, 2	2010-04-13
Atomic layer deposition apparatus Grant 7,660,644 - Chin , et al. February 9, 2	2010-02-09
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20090156003 - XI; MING ; et al.	2009-06-18
Pulsed Deposition Process For Tungsten Nucleation App 20080317954 - LU; XINLIANG ; et al.	2008-12-25
Method for depositing tungsten-containing layers by vapor deposition techniques Grant 7,465,665 - Xi , et al. December 16, 2	2008-12-16
Methods For Depositing Tungsten Layers Employing Atomic Layer Deposition Techniques App 20080280438 - Lai; Ken Kaung ; et al.	2008-11-13
Methods for depositing tungsten layers employing atomic layer deposition techniques Grant 7,405,158 - Lai , et al. July 29, 2	2008-07-29
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20070218688 - Xi; Ming ; et al.	2007-09-20
Method for depositing tungsten-containing layers by vapor deposition techniques Grant 7,220,673 - Xi , et al. May 22, 2	2007-05-22
Pulsed nucleation deposition of tungsten layers Grant 7,211,144 - Lu , et al. May 1, 2	2007-05-01
Pulse nucleation enhanced nucleation technique for improved step coverage and better gap fill for WCVD process App 20070009658 - Yoo; Jong Hyun ; et al.	2007-01-11
Method For Depositing Tungsten-containing Layers By Vapor Deposition Techniques App 20060264031 - Xi; Ming ; et al.	2006-11-23
Atomic Layer Deposition Apparatus App 20060223286 - Chin; Barry L. ; et al.	2006-10-05
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer Grant 7,101,795 - Xi , et al. September 5, 2	2006-09-05
Atomic layer deposition apparatus Grant 7,085,616 - Chin , et al. August 1, 2	2006-08-01
Methods for depositing tungsten layers employing atomic layer deposition techniques App 20060009034 - Lai; Ken Kaung ; et al.	2006-01-12
Method for depositing refractory metal layers employing sequential deposition techniques App 20040247788 - Fang, Hongbin ; et al.	2004-12-09
Method and apparatus for depositing refractory metal layers employing sequential deposition techniques to form a nucleation layer App 20040209465 - Xi, Ming ; et al.	2004-10-21
Method for depositing refractory metal layers employing sequential deposition techniques Grant 6,797,340 - Fang , et al. September 28, 2	2004-09-28
Pulsed nucleation deposition of tungsten layers App 20030127043 - Lu, Xinliang ; et al.	2003-07-10
Deposition of tungsten for the formation of conformal tungsten silicide App 20030123216 - Yoon, Hyungsuk A. ; et al.	2003-07-03
Method for depositing refractory metal layers employing sequential deposition techniques App 20030104126 - Fang, Hongbin ; et al.	2003-06-05
Microwave heat shield for plasma chamber App 20030066486 - Zheng, Bo ; et al.	2003-04-10
Atomic layer deposition apparatus App 20030023338 - Chin, Barry L. ; et al.	2003-01-30
Showerhead with reduced contact area Grant 6,461,435 - Littau , et al. October 8, 2	2002-10-08

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