Lai; Ken-Hsien
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Ken-Hsien.The latest application filed is for "back pressure control method of injection molding machine driven by servo motor".
- Lai; Ken-Hsien - Taoyuan TW
- Lai; Ken-Hsien - Hsinchu TW
- Lai; Ken Hsien - Tao-Yuan TW
- Lai, Ken-Hsien - Hsinchu Hsien TW
- Lai, Ken-Hsien - Taoyuan City TW
| Patent | Date |
|---|---|
| Servo-driven clamping unit for use in injection molding machine Grant 6,752,619 - Lai , et al. June 22, 2 | 2004-06-22 |
| Servo-driven type mold clamping unit mold protection method Grant 6,641,757 - Liu , et al. November 4, 2 | 2003-11-04 |
| Sensing and reckoning mechanism for injection machine Grant 6,619,944 - Tsai , et al. September 16, 2 | 2003-09-16 |
| Servo-driven Type Mold Clamping Unit Mold Protection Method App 20030160344 - Liu, Hsing-Chang ; et al. | 2003-08-28 |
| Back pressure control method of injection molding machine driven by servo motor App 20030160345 - Liu, Hsing-Chang ; et al. | 2003-08-28 |
| Servo drive type automatic mold-adjusting control method App 20030141610 - Liu, Hsing-Chang ; et al. | 2003-07-31 |
| Servo-driven clamping unit for use in injection molding machine App 20030113400 - Lai, Ken-Hsien ; et al. | 2003-06-19 |
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