Lai; Jeng-Yuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Jeng-Yuan.The latest application filed is for "package substrate having landless conductive traces".

Company Profile

0.11.14

Lai; Jeng-Yuan - Taichung Hsien TW
Lai; Jeng Yuan - Taichung City TW
Lai; Jeng-Yuan - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package substrate having landless conductive traces Grant 8,304,665 - Chang , et al. November 6, 2	2012-11-06
Flip-chip semiconductor package and chip carrier for preventing corner delamination Grant 8,207,620 - Tzeng , et al. June 26, 2	2012-06-26
Package Substrate Having Landless Conductive Traces App 20090283303 - Chang; Chiang-Cheng ; et al.	2009-11-19
Semiconductor device and method for fabricating the same App 20090008801 - Lai; Jeng-Yuan ; et al.	2009-01-08
Semiconductor package and method for fabricating the same App 20080303134 - Li; Chun-Yuan ; et al.	2008-12-11
Semiconductor package substrate App 20080277786 - Chen; Chun-Lung ; et al.	2008-11-13
Heat dissipation unit and a semiconductor package that has the heat dissipation unit App 20080246142 - Lai; Jeng-Yuan ; et al.	2008-10-09
Method for fabricating semiconductor package Grant 7,364,948 - Lai , et al. April 29, 2	2008-04-29
Electronic Component Test System App 20080061814 - Pan; Tai-Fu ; et al.	2008-03-13
Flip-chip semiconductor package and chip carrier thereof App 20080017983 - Tzeng; Yuan-Lin ; et al.	2008-01-24
Semiconductor device and chip structure thereof App 20070262444 - Chen; Yung-Chang ; et al.	2007-11-15
Method for fabricating semiconductor package App 20070108592 - Lai; Jeng-Yuan ; et al.	2007-05-17
Semiconductor package and fabrication method thereof Grant 7,199,453 - Lai , et al. April 3, 2	2007-04-03
Electronic component test system App 20060279319 - Pan; Tai-Fu ; et al.	2006-12-14
Semiconductor package and fabrication method thereof App 20060118941 - Lai; Jeng-Yuan ; et al.	2006-06-08
Lead frame and semiconductor package with the same Grant 7,019,389 - Lai , et al. March 28, 2	2006-03-28
Lead frame and semiconductor package with the same App 20050098860 - Lai, Jeng-Yuan ; et al.	2005-05-12
Cavity-down ball grid array package with semiconductor chip solder ball Grant 6,650,015 - Chen , et al. November 18, 2	2003-11-18
Cavity-down ball grid array package with semiconductor chip solder ball App 20030146508 - Chen, Eing-Chieh ; et al.	2003-08-07
Externally-embedded heat-dissipating device for ball grid array integrated circuit package Grant 6,369,455 - Ho , et al. April 9, 2	2002-04-09
Heat-dissipating structure for integrated circuit package Grant 6,323,066 - Lai , et al. November 27, 2	2001-11-27
Ball-grid array integrated circuit package with an embedded type of heat-dissipation structure and method of manufacturing the same Grant 6,282,094 - Lo , et al. August 28, 2	2001-08-28
Heat-dissipating structure for integrated circuit package App 20010008776 - Lai, Jeng Yuan ; et al.	2001-07-19
Semiconductor package having a heat sink with an exposed surface Grant 6,246,115 - Tang , et al. June 12, 2	2001-06-12
Heat-dissipating structure for integrated circuit package Grant 6,236,568 - Lai , et al. May 22, 2	2001-05-22

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