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name:-0.0079870223999023
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Lai; Jane-Bai Patent Filings

Lai; Jane-Bai

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Jane-Bai.The latest application filed is for "plasma treatment method for electromigration reduction".

Company Profile
0.7.4
  • Lai; Jane-Bai - Hsin-Chu TW
  • Lai; Jane-Bai - Fengyuan City TW
  • Lai; Jane-Bai - Fengyuan TW
  • Lai; Jane-Bai - Fueng-Yuan TW
  • Lai; Jane-Bai - Hsinchu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Plasma treatment method for electromigration reduction
Grant 7,208,415 - Lai , et al. April 24, 2
2007-04-24
Plasma treatment method for electromigration reduction
App 20060003486 - Lai; Jane-Bai ;   et al.
2006-01-05
Method of wet etching low dielectric constant materials
Grant 6,780,783 - Lai , et al. August 24, 2
2004-08-24
Method of improving the bondability between Au wires and Cu bonding pads
Grant 6,753,259 - Jang , et al. June 22, 2
2004-06-22
Method and solution for preparing SEM samples for low-K materials
Grant 6,660,655 - Lai December 9, 2
2003-12-09
Method and solution for preparing SEM samples for low-K materials
App 20030157802 - Lai, Jane-Bai
2003-08-21
Method of wet etching low dielectric constant materials
App 20030049938 - Lai, Jane-Bai ;   et al.
2003-03-13
Method of improving the bondability between Au wires and Cu bonding pads
Grant 6,423,625 - Jang , et al. July 23, 2
2002-07-23
Method of improving the bondability between Au wires and Cu bonding pads
App 20020086533 - Jang, Syun-Ming ;   et al.
2002-07-04
Methods to improve copper-fluorinated silica glass interconnects
Grant 6,136,680 - Lai , et al. October 24, 2
2000-10-24
Method to improve adhesion between copper and titanium nitride, for copper interconnect structures, via the use of an ion implantation procedure
Grant 6,015,749 - Liu , et al. January 18, 2
2000-01-18

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