Lai; Gor Amie
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Gor Amie.The latest application filed is for "method for forming reinforced interconnects on a substrate".
- Lai; Gor Amie - Tseung Kwan HK
- Lai; Gor Amie - Hong Kong HK
- Lai; Gor Amie - Tseung Kwan O HK
| Patent | Date |
|---|---|
| Method for forming reinforced interconnects on a substrate Grant 7,494,924 - Shiu , et al. February 24, 2 | 2009-02-24 |
| Method for forming multi-layer bumps on a substrate Grant 7,422,973 - Shiu , et al. September 9, 2 | 2008-09-09 |
| Method for forming multi-layer bumps on a substrate Grant 7,279,409 - Shiu , et al. October 9, 2 | 2007-10-09 |
| Method for forming reinforced interconnects on a substrate App 20070207605 - Shiu; Hei Ming ; et al. | 2007-09-06 |
| Method for forming multi-layer bumps on a substrate App 20070178688 - Shiu; Hei Ming ; et al. | 2007-08-02 |
| Method for forming multi-layer bumps on a substrate App 20070099413 - Shiu; Hei Ming ; et al. | 2007-05-03 |
| Lead frame panel and method of packaging semiconductor devices using the lead frame panel App 20060208344 - Shiu; Hei Ming ; et al. | 2006-09-21 |
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