LAI; Fengyuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for LAI; Fengyuan.The latest application filed is for "ex situ coating of chamber components for semiconductor processing".

Company Profile

3.7.9

LAI; Fengyuan - Sherwood OR
Lai; Fengyuan - Tualatin OR
Lai; Fengyuan - Troy NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Ex Situ Coating Of Chamber Components For Semiconductor Processing App 20220275504 - SHANBHAG; Damodar Rajaram ; et al.	2022-09-01
SixNy AS A NUCLEATION LAYER FOR SiCxOy App 20220235463 - Yuan; Guangbi ; et al.	2022-07-28
Ex situ coating of chamber components for semiconductor processing Grant 11,365,479 - Shanbhag , et al. June 21, 2	2022-06-21
Oxidation Resistant Protective Layer In Chamber Conditioning App 20210164097 - Lai; Fengyuan ; et al.	2021-06-03
Ex Situ Coating Of Chamber Components For Semiconductor Processing App 20200347497 - Shanbhag; Damodar ; et al.	2020-11-05
Ex situ coating of chamber components for semiconductor processing Grant 10,760,158 - Shanbhag , et al. Sep	2020-09-01
Ex Situ Coating Of Chamber Components For Semiconductor Processing App 20190185999 - Shanbhag; Damodar ; et al.	2019-06-20
Remote plasma based deposition of graded or multi-layered silicon carbide film Grant 10,297,442 - Varadarajan , et al.	2019-05-21
Remote Plasma Based Deposition Of Graded Or Multi-layered Silicon Carbide Film App 20180240664 - Varadarajan; Bhadri N. ; et al.	2018-08-23
Remote Plasma Based Deposition Of Graded Or Multi-layered Silicon Carbide Film App 20180096842 - Varadarajan; Bhadri N. ; et al.	2018-04-05
Densification of silicon carbide film using remote plasma treatment Grant 9,837,270 - Varadarajan , et al. December 5, 2	2017-12-05
High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Grant 9,512,291 - Borca-Tasciuc , et al. December 6, 2	2016-12-06
High Thermal Conductance Thermal Interface Materials Based On Nanostructured Metallic Network-polymer Composites App 20150247019 - Borca-Tasciuc; Theodorian ; et al.	2015-09-03
High thermal conductance thermal interface materials based on nanostructured metallic network-polymer composites Grant 9,045,674 - Iruvanti , et al. June 2, 2	2015-06-02
High Thermal Conductance Thermal Interface Materials Based On Nanostructured Metallic Network-polymer Composites App 20120187332 - Iruvanti; Sushumna ; et al.	2012-07-26

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