| Patent | Date |
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Substantially Carbon-free Molybdenum-containing And Tungsten-containing Films In Semiconductor Device Manufacturing
App 20220298624 - Blakeney; Kyle Jordan ; et al. | 2022-09-22 |
Low Resistivity Films Containing Molybdenum
App 20220223471 - THOMBARE; Shruti Vivek ; et al. | 2022-07-14 |
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill
App 20220115244 - LAI; Chiukin Steven ; et al. | 2022-04-14 |
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill
App 20210305059 - Lai; Chiukin Steven ; et al. | 2021-09-30 |
Atomic layer etch of tungsten for enhanced tungsten deposition fill
Grant 11,069,535 - Lai , et al. July 20, 2 | 2021-07-20 |
Low Resistivity Films Containing Molybdenum
App 20200365456 - Thombare; Shruti Vivek ; et al. | 2020-11-19 |
Low resistivity films containing molybdenum
Grant 10,777,453 - Thombare , et al. Sept | 2020-09-15 |
Atomic Layer Etch Of Tungsten For Enhanced Tungsten Deposition Fill
App 20200286743 - Lai; Chiukin Steven ; et al. | 2020-09-10 |
Depositing ruthenium layers in interconnect metallization
Grant 10,731,250 - Kim , et al. | 2020-08-04 |
Low Resistivity Films Containing Molybdenum
App 20200075403 - Thombare; Shruti Vivek ; et al. | 2020-03-05 |
Low resistivity films containing molybdenum
Grant 10,510,590 - Thombare , et al. Dec | 2019-12-17 |
Manganese barrier and adhesion layers for cobalt
Grant 10,438,847 - Lai , et al. O | 2019-10-08 |
Selective deposition of WCN barrier/adhesion layer for interconnect
Grant 10,283,404 - Na , et al. | 2019-05-07 |
Systems and methods for forming low resistivity metal contacts and interconnects by reducing and removing metallic oxide
Grant 10,229,826 - Tarafdar , et al. | 2019-03-12 |
Depositing Ruthenium Layers In Interconnect Metallization
App 20180347041 - Kim; Do Young ; et al. | 2018-12-06 |
Low Resistivity Films Containing Molybdenum
App 20180294187 - Thombare; Shruti Vivek ; et al. | 2018-10-11 |
Selective Deposition Of Wcn Barrier/adhesion Layer For Interconnect
App 20180286746 - Na; Jeong-Seok ; et al. | 2018-10-04 |
Atomic Layer Etch Of Tungsten For Enhanced Tungsten Deposition Fill
App 20180240682 - Lai; Chiukin Steven ; et al. | 2018-08-23 |
Atomic layer etching of tungsten for enhanced tungsten deposition fill
Grant 9,972,504 - Lai , et al. May 15, 2 | 2018-05-15 |
Systems And Methods For Forming Low Resistivity Metal Contacts And Interconnects By Reducing And Removing Metallic Oxide
App 20180114694 - Tarafdar; Raihan ; et al. | 2018-04-26 |
Manganese Barrier And Adhesion Layers For Cobalt
App 20170330797 - Lai; Chiukin Steven ; et al. | 2017-11-16 |
Method for void-free cobalt gap fill
Grant 9,748,137 - Lai , et al. August 29, 2 | 2017-08-29 |
Atomic Layer Etching Of Tungsten For Enhanced Tungsten Deposition Fill
App 20170040214 - Lai; Chiukin Steven ; et al. | 2017-02-09 |
Methods and apparatuses for atomic layer cleaning of contacts and vias
Grant 9,362,163 - Danek , et al. June 7, 2 | 2016-06-07 |
Method For Void-free Cobalt Gap Fill
App 20160056077 - Lai; Chiukin Steven ; et al. | 2016-02-25 |
Methods And Apparatuses For Atomic Layer Cleaning Of Contacts And Vias
App 20150037972 - Danek; Michal ; et al. | 2015-02-05 |
Method for removing oxides
Grant 8,846,163 - Kao , et al. September 30, 2 | 2014-09-30 |
Multi Chamber Processing System
App 20140076234 - KAO; Chien-Teh ; et al. | 2014-03-20 |
Modulating etch selectivity and etch rate of silicon nitride thin films
Grant 8,617,348 - Liu , et al. December 31, 2 | 2013-12-31 |
Method For Removing Oxides
App 20120244704 - KAO; Chien-Teh ; et al. | 2012-09-27 |
Modulating etch selectivity and etch rate of silicon nitride thin films
Grant 8,187,486 - Liu , et al. May 29, 2 | 2012-05-29 |
Method For Removing Oxides
App 20110223755 - KAO; CHIEN-TEH ; et al. | 2011-09-15 |
Methods for removing silicon nitride and other materials during fabrication of contacts
Grant 7,977,249 - Liu , et al. July 12, 2 | 2011-07-12 |
Method for front end of line fabrication
Grant 7,767,024 - Kao , et al. August 3, 2 | 2010-08-03 |
Method For Removing Oxides
App 20090111280 - Kao; Chien-Teh ; et al. | 2009-04-30 |
Lid assembly for front end of line fabrication
Grant 7,520,957 - Kao , et al. April 21, 2 | 2009-04-21 |
Method For Front End Of Line Fabrication
App 20080268645 - KAO; CHIEN-TEH ; et al. | 2008-10-30 |
Method for front end of line fabrication
Grant 7,396,480 - Kao , et al. July 8, 2 | 2008-07-08 |
Monitoring a flow distribution of an energized gas
App 20060093730 - Phan; See-Eng ; et al. | 2006-05-04 |
In-situ dry clean chamber for front end of line fabrication
App 20050230350 - Kao, Chien-Teh ; et al. | 2005-10-20 |
Lid assembly for front end of line fabrication
App 20050218507 - Kao, Chien-Teh ; et al. | 2005-10-06 |
Substrate support for in-situ dry clean chamber for front end of line fabrication
App 20050221552 - Kao, Chien-Teh ; et al. | 2005-10-06 |
Method for front end of line fabrication
App 20050205110 - Kao, Chien-Teh ; et al. | 2005-09-22 |
Cleaning of native oxide with hydrogen-containing radicals
App 20040219789 - Wood, Bingxi Sun ; et al. | 2004-11-04 |
Method of tisin deposition using a chemical vapor deposition process
App 20020114886 - Chou, Jing-Pei ; et al. | 2002-08-22 |
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