LAI; Ching-Lun
Patent Applications and Registrations
Patent applications and USPTO patent grants for LAI; Ching-Lun.The latest application filed is for "integrated circuit with anti-punch through control".
- LAI; Ching-Lun - Hsinchu TW
- Lai; Ching-Lun - Taichung TW
- LAI; Ching-Lun - Taichung City TW
| Patent | Date |
|---|---|
| Integrated Circuit With Anti-punch Through Control App 20220246609 - HO; Yi-Chen ; et al. | 2022-08-04 |
| Integrated circuit with anti-punch through control Grant 11,315,921 - Ho , et al. April 26, 2 | 2022-04-26 |
| Semiconductor manufacturing apparatus Grant 11,183,405 - Tsai , et al. November 23, 2 | 2021-11-23 |
| Integrated Circuit With Anti-punch Through Control App 20210193653 - HO; Yi-Chen ; et al. | 2021-06-24 |
| Apparatus and method for spatial atomic layer deposition Grant 11,008,654 - Lin , et al. May 18, 2 | 2021-05-18 |
| Apparatus and Method for Spatial Atomic Layer Deposition App 20200095682 - Lin; Anthony ; et al. | 2020-03-26 |
| Apparatus and method for spatial atomic layer deposition Grant 10,494,716 - Lin , et al. De | 2019-12-03 |
| Semiconductor Manufacturing Apparatus App 20190244841 - TSAI; CHAO-TZUNG ; et al. | 2019-08-08 |
| Apparatus and Method for Spatial Atomic Layer Deposition App 20190136378 - Lin; Anthony ; et al. | 2019-05-09 |
| Semiconductor manufacturing apparatus Grant 10,269,599 - Tsai , et al. | 2019-04-23 |
| Apparatus and method for spatial atomic layer deposition Grant 10,161,039 - Lin , et al. Dec | 2018-12-25 |
| Method for manufacturing a semiconductor device Grant 10,043,892 - Li , et al. August 7, 2 | 2018-08-07 |
| Semiconductor Device And Fabrication Method Therefor App 20180151372 - SIE; Yuan-Chun ; et al. | 2018-05-31 |
| Apparatus and Method for Spatial Atomic Layer Deposition App 20180142351 - Lin; Anthony ; et al. | 2018-05-24 |
| Apparatus and method for spatial atomic layer deposition Grant 9,873,943 - Lin , et al. January 23, 2 | 2018-01-23 |
| Method for forming semiconductor device structure Grant 9,871,137 - Huang , et al. January 16, 2 | 2018-01-16 |
| Method For Manufacturing A Semiconductor Device App 20170358663 - LI; Chia-Ying ; et al. | 2017-12-14 |
| Apparatus and Method for Spatial Atomic Layer Deposition App 20170167021 - Lin; Anthony ; et al. | 2017-06-15 |
| Method For Forming Semiconductor Device Structure App 20170040451 - HUANG; Shin-Yeh ; et al. | 2017-02-09 |
| Method for forming semiconductor device structure Grant 9,478,617 - Huang , et al. October 25, 2 | 2016-10-25 |
| Method For Forming Semiconductor Device Structure App 20160064486 - HUANG; Shin-Yeh ; et al. | 2016-03-03 |
| Apparatus And Method For Processing Semiconductor Wafers App 20160035563 - LIN; TZU-KEN ; et al. | 2016-02-04 |
| Semiconductor Manufacturing Apparatus App 20150371882 - TSAI; CHAO-TZUNG ; et al. | 2015-12-24 |
| Semiconductor device structure Grant 9,202,916 - Huang , et al. December 1, 2 | 2015-12-01 |
| Semiconductor Device Structure And Method For Manufacturing The Same App 20150187940 - HUANG; Shin-Yeh ; et al. | 2015-07-02 |
| Crack inhibited composite dielectric layer Grant 6,828,255 - Lai , et al. December 7, 2 | 2004-12-07 |
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