LAI; Chih-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for LAI; Chih-Yi.The latest application filed is for "printing method for three-dimensional painting by uv digital printing device".

Company Profile

0.5.6

LAI; Chih-Yi - New Taipei City TW
Lai; Chih-Yi - Sijhih TW
LAI; Chih-Yi - Sijhih City TW
Lai; Chih-Yi - Jhudong Township Hsinchu County TW
Lai; Chih-Yi - Hsinchu County TW
Lai; Chih-Yi - Hsinchu TW
Lai; Chih-Yi - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Printing Method For Three-dimensional Painting By Uv Digital Printing Device App 20130147870 - YEH; Awen ; et al.	2013-06-13
Pneumatic ink-jet system Grant 7,731,318 - Liu , et al. June 8, 2	2010-06-08
Pneumatic Ink-jet System App 20090219350 - LIU; Chi-Shi ; et al.	2009-09-03
Cutting tool angle adjustment method Grant 7,359,763 - Chen , et al. April 15, 2	2008-04-15
Cutting tool angle adjustment method App 20060036337 - Chen; Kuei-Jung ; et al.	2006-02-16
Brittle material breaking apparatus Grant 6,932,259 - Chen , et al. August 23, 2	2005-08-23
Method and apparatus for monitoring the operation of a wafer handling robot Grant 6,871,115 - Huang , et al. March 22, 2	2005-03-22
Cutting device for breaking fragile materials such as semiconductor wafers or the like Grant 6,782,883 - Chen , et al. August 31, 2	2004-08-31
Cutting device for breaking fragile materials such as semiconductor wafers or the like App 20040094010 - Chen, Kuei-Jung ; et al.	2004-05-20
Method and apparatus for monitoring the operation of a wafer handling robot App 20040073336 - Huang, Kuo-Liang ; et al.	2004-04-15

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