Lai; Chih-Hsin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Chih-Hsin.The latest application filed is for "method for fabricating leadframe-based semiconductor package".
- Lai; Chih-Hsin - Taichung TW
- LAI; CHIH- HSIN - Changhua County TW
| Patent | Date |
|---|---|
| Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier Grant 9,130,064 - Chan , et al. September 8, 2 | 2015-09-08 |
| Method For Fabricating Leadframe-based Semiconductor Package App 20140080264 - Chan; Chang-Yueh ; et al. | 2014-03-20 |
| Leadframe-based semiconductor package Grant 8,618,641 - Chan , et al. December 31, 2 | 2013-12-31 |
| Tire App 20130312883 - YANG; YING-MING ; et al. | 2013-11-28 |
| Semiconductor package and method for fabricating the same App 20090039488 - Chan; Chang-Yueh ; et al. | 2009-02-12 |
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