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Patent applications and USPTO patent grants for Lai; Chih-Hsin.The latest application filed is for "method for fabricating leadframe-based semiconductor package".
Patent | Date |
---|---|
Method for fabricating leadframe-based semiconductor package with connecting pads top and bottom surfaces of carrier Grant 9,130,064 - Chan , et al. September 8, 2 | 2015-09-08 |
Method For Fabricating Leadframe-based Semiconductor Package App 20140080264 - Chan; Chang-Yueh ;   et al. | 2014-03-20 |
Leadframe-based semiconductor package Grant 8,618,641 - Chan , et al. December 31, 2 | 2013-12-31 |
Tire App 20130312883 - YANG; YING-MING ;   et al. | 2013-11-28 |
Semiconductor package and method for fabricating the same App 20090039488 - Chan; Chang-Yueh ;   et al. | 2009-02-12 |
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