Lai; Chia-Hung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lai; Chia-Hung.The latest application filed is for "method of forming shallow trench isolation structure".

Company Profile

3.14.15

Lai; Chia-Hung - Hsinchu TW
Lai; Chia-Hung - Keelung TW
LAI; Chia-Hung - Hsinchu City TW
LAI; Chia-Hung - Keelung City TW
Lai; Chia-Hung - Tainan TW
Lai; Chia-Hung - Taichung TW
LAI; CHIA-HUNG - TAINAN CITY TW
LAI; CHIA-HUNG - Taichung City TW
Lai; Chia-Hung - Tao-Yuan Hsien TW
Lai; Chia-Hung - Kuei-Shan Hsiang TW
Lai; Chia-Hung - Hsin-Chu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of forming shallow trench isolation structure Grant 11,094,579 - Huang , et al. August 17, 2	2021-08-17
Apparatus for supporting a semiconductor wafer and method of vibrating a semiconductor wafer Grant 10,871,720 - Sharma , et al. December 22, 2	2020-12-22
Method Of Forming Shallow Trench Isolation Structure App 20200286774 - HUANG; Yen-Bin ; et al.	2020-09-10
Shallow trench isolation structure and method of forming the same Grant 10,699,938 - Huang , et al.	2020-06-30
Apparatus For Supporting A Semiconductor Wafer And Method Of Vibrating A Semiconductor Wafer App 20160096155 - SHARMA; Astha ; et al.	2016-04-07
Method and system for reminding reader of fatigue in reading while using electronic device Grant 9,269,257 - Huang , et al. February 23, 2	2016-02-23
Transparent shell structure for luggage and the like Grant 9,066,566 - Lai June 30, 2	2015-06-30
Shallow Trench Isolation Structure And Method Of Forming The Same App 20150021700 - HUANG; Yen-Bin ; et al.	2015-01-22
Method And System For Reminding Reader Of Fatigue In Reading While Using Electronic Device App 20140333435 - HUANG; YUEH-MIN ; et al.	2014-11-13
Suitcase With A Protective Cover App 20140224608 - TANG; TING-TING	2014-08-14
Transparent Shell Structure For Luggage And The Like App 20140008164 - LAI; Chia-Hung	2014-01-09
Distance adjustment system for use in solar wafer inspection machine and inspection machine provided with same Grant 8,461,857 - Lai June 11, 2	2013-06-11
Distance Adjustment System For Use In Solar Wafer Inspection Machine And Inspection Machine Provided With Same App 20120013897 - Lai; Chia-Hung	2012-01-19
Laminated silicate glass layer etch stop method for fabricating microelectronic product Grant 7,160,811 - Chen , et al. January 9, 2	2007-01-09
Method for manufacturing dual damascene structure with a trench formed first App 20060194426 - Yang; Chin-Tien ; et al.	2006-08-31
Method for manufacturing dual damascene structure with a trench formed first Grant 7,056,821 - Yang , et al. June 6, 2	2006-06-06
Bond pad scheme for Cu process Grant 7,015,129 - Lai , et al. March 21, 2	2006-03-21
Method for manufacturing dual damascene structure with a trench formed first App 20060040498 - Yang; Chin-Tien ; et al.	2006-02-23
Interconnect structure and method for its fabricating App 20050173799 - Jou, Juan-Jann ; et al.	2005-08-11
Bond pad scheme for Cu process App 20050095836 - Lai, Chia-Hung ; et al.	2005-05-05
Bond pad scheme for Cu process Grant 6,844,626 - Lai , et al. January 18, 2	2005-01-18
Bond Pad Scheme For Cu Process App 20040235223 - Lai, Chia-Hung ; et al.	2004-11-25
Laminated silicate glass layer etch stop method for fabricating microelectronic product App 20040074872 - Chen, Yen-Ming ; et al.	2004-04-22
Method of stripping photoresist from Al bonding pads that prevents corrosion Grant 6,006,764 - Chu , et al. December 28, 1	1999-12-28

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