LAI; Chia-Han
Patent Applications and Registrations
Patent applications and USPTO patent grants for LAI; Chia-Han.The latest application filed is for "interconnect structures and manufacturing method thereof".
- LAI; Chia-Han - Hsinchu County TW
- Lai; Chia-Han - Zhubei TW
- Lai; Chia-Han - Zhubei City TW
| Patent | Date |
|---|---|
| Interconnect Structures And Manufacturing Method Thereof App 20220293503 - HUANG; Chun-Hsien ; et al. | 2022-09-15 |
| Contact structure and formation thereof Grant 11,444,028 - Lee , et al. September 13, 2 | 2022-09-13 |
| Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition App 20210193517 - Chen; Pin-Wen ; et al. | 2021-06-24 |
| Conductive Feature Formation and Structure App 20210074580 - Chen; Pin-Wen ; et al. | 2021-03-11 |
| Conductive feature formation and structure using bottom-up filling deposition Grant 10,943,823 - Chen , et al. March 9, 2 | 2021-03-09 |
| Conductive feature formation and structure Grant 10,847,411 - Chen , et al. November 24, 2 | 2020-11-24 |
| Interconnect formation and structure Grant 10,804,140 - Chen , et al. October 13, 2 | 2020-10-13 |
| Contact Structure And Formation Thereof App 20200118935 - LEE; Hong-Mao ; et al. | 2020-04-16 |
| Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition App 20200051858 - Chen; Pin-Wen ; et al. | 2020-02-13 |
| Conductive Feature Formation and Structure App 20190385904 - Chen; Pin-Wen ; et al. | 2019-12-19 |
| Contact structure and formation thereof Grant 10,510,664 - Lee , et al. Dec | 2019-12-17 |
| Conductive feature formation and structure using bottom-up filling deposition Grant 10,475,702 - Chen , et al. Nov | 2019-11-12 |
| Conductive Feature Formation and Structure App 20190304833 - CHEN; Pin-Wen ; et al. | 2019-10-03 |
| Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition App 20190287851 - CHEN; Pin-Wen ; et al. | 2019-09-19 |
| Opening fill process and structures formed thereby Grant 9,978,583 - Tsai , et al. May 22, 2 | 2018-05-22 |
| Contact Structure And Formation Thereof App 20170345765 - Lee; Hong-Mao ; et al. | 2017-11-30 |
| Contact structure and formation thereof Grant 9,735,107 - Lee , et al. August 15, 2 | 2017-08-15 |
| Opening Fill Process and Structures Formed Thereby App 20170213720 - Tsai; Chun-I ; et al. | 2017-07-27 |
| Semiconductor device and method for forming the same Grant 9,653,594 - Tsai , et al. May 16, 2 | 2017-05-16 |
| Opening fill process and structure formed thereby Grant 9,627,313 - Tsai , et al. April 18, 2 | 2017-04-18 |
| Contact critical dimension control Grant 9,449,922 - Chang , et al. September 20, 2 | 2016-09-20 |
| Contact Structure And Formation Thereof App 20160190068 - Lee; Hong-Mao ; et al. | 2016-06-30 |
| Contact Critical Dimension Control App 20160172303 - Chang; Tain-Shang ; et al. | 2016-06-16 |
| Semiconductor Device and Method for Forming the Same App 20160163847 - Tsai; Wen-Chi ; et al. | 2016-06-09 |
| Opening Fill Process and Structure Formed Thereby App 20160155703 - Tsai; Chun-I ; et al. | 2016-06-02 |
| Contact critical dimension control Grant 9,299,607 - Chang , et al. March 29, 2 | 2016-03-29 |
| Contact structure and formation thereof Grant 9,287,170 - Lee , et al. March 15, 2 | 2016-03-15 |
| Semiconductor device and method for forming the same Grant 9,252,019 - Tsai , et al. February 2, 2 | 2016-02-02 |
| Opening fill process and structure formed thereby Grant 9,245,797 - Tsai , et al. January 26, 2 | 2016-01-26 |
| Method of integrated circuit fabrication Grant 9,219,009 - Lai , et al. December 22, 2 | 2015-12-22 |
| Contact Critical Dimension Control App 20150228537 - Chang; Tain-Shang ; et al. | 2015-08-13 |
| Method of Integrated Circuit Fabrication App 20150179512 - LAI; Chia-Han ; et al. | 2015-06-25 |
| Contact Structure And Formation Thereof App 20150147880 - Lee; Hong-Mao ; et al. | 2015-05-28 |
| Opening Fill Process and Structure Formed Thereby App 20150048511 - Tsai; Chun-I ; et al. | 2015-02-19 |
| Systems and Methods for Reducing Contact Resistivity of Semiconductor Devices App 20150021757 - LIN; CHENG-TUNG ; et al. | 2015-01-22 |
| Systems and methods for reducing contact resistivity of semiconductor devices Grant 8,927,418 - Lin , et al. January 6, 2 | 2015-01-06 |
| Semiconductor Device and Method for Forming the Same App 20130049219 - Tsai; Wen-Chi ; et al. | 2013-02-28 |
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