Lai; Cheng-Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Lai; Cheng-Yuan.The latest application filed is for "display".
- Lai; Cheng-Yuan - Taipei TW
- Lai; Cheng-Yuan - Taipei City TW
- Lai; Cheng-Yuan - Taichung TW
| Patent | Date |
|---|---|
| Display Grant 9,223,164 - Lai , et al. December 29, 2 | 2015-12-29 |
| Display App 20150036206 - Lai; Cheng-Yuan ; et al. | 2015-02-05 |
| Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same Grant 6,716,676 - Chen , et al. April 6, 2 | 2004-04-06 |
| Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same App 20030020151 - Chen, Eing-Chieh ; et al. | 2003-01-30 |
| Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same Grant 6,472,741 - Chen , et al. October 29, 2 | 2002-10-29 |
| Semiconductor package Grant 6,462,405 - Lai , et al. October 8, 2 | 2002-10-08 |
| Semiconductor package App 20020053724 - Lai, Cheng-Yuan ; et al. | 2002-05-09 |
| Semiconductor Package With Heat Dissipation Opening App 20010040300 - HUANG, CHIEN-PING ; et al. | 2001-11-15 |
| Semiconductor package having lead frame with an exposed base pad Grant 6,114,752 - Huang , et al. September 5, 2 | 2000-09-05 |
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