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Solar Module, Solar Module-integrable Assembly And Power Generation System
App 20220090826 - Thiel; Raimund ; et al. | 2022-03-24 |
Unfolding bridge, inverter having reactive-power capability, and polarity reversing method
Grant 10,530,273 - Friebe , et al. J | 2020-01-07 |
Unfolding Bridge, Inverter Having Reactive-power Capability, And Polarity Reversing Method
App 20180152118 - Friebe; Jens ; et al. | 2018-05-31 |
Interconnect structure for semiconductor devices
Grant 8,138,538 - Moll , et al. March 20, 2 | 2012-03-20 |
Method and apparatus for reducing charge trapping in high-k dielectric material
Grant 7,894,240 - Beck , et al. February 22, 2 | 2011-02-22 |
Methods for forming an integrated circuit, including openings in a mold layer from nanowires or nanotubes
Grant 7,776,759 - Lahnor , et al. August 17, 2 | 2010-08-17 |
Method for Structuring a Layered Stack
App 20100099253 - Baier; Ulrich ; et al. | 2010-04-22 |
Interconnect Structure For Semiconductor Devices
App 20100090264 - Moll; Hans-Peter ; et al. | 2010-04-15 |
Method and Apparatus for Reducing Charge Trapping in High-K Dielectric Material
App 20100054022 - Beck; Michael ; et al. | 2010-03-04 |
Apparatus And Method Of Manufacturing An Integrated Circuit
App 20090142916 - Prenz; Heike ; et al. | 2009-06-04 |
Integrated Circuit Having A Memory
App 20080217672 - Popp; Martin ; et al. | 2008-09-11 |
Methods For Forming An Integrated Circuit, Including Openings In A Mold Layer
App 20070286945 - Lahnor; Peter ; et al. | 2007-12-13 |
Method of determining the endpoint of a planarization process
Grant 6,932,674 - Lahnor , et al. August 23, 2 | 2005-08-23 |
Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices
Grant 6,893,968 - Lahnor , et al. May 17, 2 | 2005-05-17 |
Method of planarizing substrates
Grant 6,827,635 - Lahnor , et al. December 7, 2 | 2004-12-07 |
CMP process
Grant 6,821,894 - Lahnor , et al. November 23, 2 | 2004-11-23 |
Method Of Planarizing Substrates
App 20040185756 - Lahnor, Peter ; et al. | 2004-09-23 |
Method Of Determining The Endpoint Of A Planarization Process
App 20040176015 - Lahnor, Peter ; et al. | 2004-09-09 |
Method and semiconductor wafer configuration for producing an alignment mark for semiconductor wafers
Grant 6,787,431 - Lahnor September 7, 2 | 2004-09-07 |
Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate
Grant 6,695,687 - Hollatz , et al. February 24, 2 | 2004-02-24 |
Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation
Grant 6,689,691 - Lahnor February 10, 2 | 2004-02-10 |
Defect-minimizing, topology-independent planarization of process surfaces in semiconductor devices
App 20030190809 - Lahnor, Peter ; et al. | 2003-10-09 |
Method and semiconductor wafer configuration for producing an alignment mark for semiconductor wafers
App 20030096488 - Lahnor, Peter | 2003-05-22 |
Semiconductor substrate holder for chemical-mechanical polishing containing a movable plate
App 20020177394 - Hollatz, Mark ; et al. | 2002-11-28 |
Method of simultaneously polishing a plurality of objects of a similar type, in particular silicon wafers, on a polishing installation
App 20020146877 - Lahnor, Peter | 2002-10-10 |
CMP process
App 20020036181 - Lahnor, Peter ; et al. | 2002-03-28 |
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