Lagahe Blanchard; Chrystelle

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lagahe Blanchard; Chrystelle.The latest application filed is for "method for trimming a structure obtained by the assembly of two plates".

Company Profile

0.13.11

Lagahe Blanchard; Chrystelle - Crolles N/A FR
Lagahe-Blanchard; Chrystelle - St. Joseph de Riviere FR
Lagahe-Blanchard; Chrystelle - Saint Joseph de Riviere FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of bonding by molecular bonding Grant 8,927,320 - Lagahe Blanchard , et al. January 6, 2	2015-01-06
Method for trimming a structure obtained by the assembly of two plates Grant 8,628,674 - Zussy , et al. January 14, 2	2014-01-14
Methods of making substrate structures having a weakened intermediate layer Grant 8,475,693 - Bruel , et al. July 2, 2	2013-07-02
Method For Trimming A Structure Obtained By The Assembly Of Two Plates App 20130078785 - Zussy; Marc ; et al.	2013-03-28
Method for trimming a structure obtained by the assembly of two plates Grant 8,329,048 - Zussy , et al. December 11, 2	2012-12-11
Annealing process for annealing a structure Grant 8,158,487 - Sousbie , et al. April 17, 2	2012-04-17
Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate Grant 8,044,465 - Aspar , et al. October 25, 2	2011-10-25
Methods Of Making Substrate Structures Having A Weakened Intermediate Layer App 20110250416 - Bruel; Michel ; et al.	2011-10-13
Method for forming a detachable substrate including implantation and exfoliation Grant 7,927,980 - Tauzin , et al. April 19, 2	2011-04-19
Method for transferring wafers Grant 7,807,482 - Aspar , et al. October 5, 2	2010-10-05
Method For Producing Partial Soi Structures Comprising Zones Connecting A Superficial Layer And A Substrate App 20100176397 - ASPAR; Bernard ; et al.	2010-07-15
Method for producing partial SOI structures comprising zones connecting a superficial layer and a substrate Grant 7,709,305 - Aspar , et al. May 4, 2	2010-05-04
Method for Making a Plate-Like Detachable Structure, in Particular Made of Silicon, and Use of Said Method App 20090301995 - Aspar; Bernard ; et al.	2009-12-10
Method For Making A Dismountable Substrate App 20090149005 - Tauzin; Aurelie ; et al.	2009-06-11
Method For Trimming A Structure Obtained By The Assembly Of Two Plates App 20090095399 - Zussy; Marc ; et al.	2009-04-16
Method for Transferring Wafers App 20080254596 - Aspar; Bernard ; et al.	2008-10-16
Substrate layer cutting device and method Grant 7,406,994 - Martinez , et al. August 5, 2	2008-08-05
Method For Producing Partial Soi Structures Comprising Zones Connecting A Superficial Layer And A Substrate App 20070200144 - ASPAR; Bernard ; et al.	2007-08-30
Substrate Layer Cutting Device And Method App 20070122926 - Martinez; Muriel ; et al.	2007-05-31
Method for preparing and assembling substrates App 20070072393 - Aspar; Bernard ; et al.	2007-03-29
Substrate layer cutting device and method Grant 7,189,304 - Martinez , et al. March 13, 2	2007-03-13
Substrate layer cutting device and method App 20040144487 - Martinez, Muriel ; et al.	2004-07-29

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