Lafontant; Gary

Patent Applications and Registrations

Patent applications and USPTO patent grants for Lafontant; Gary.The latest application filed is for "enhanced capture pads for through semiconductor vias".

Company Profile

0.11.10

Lafontant; Gary - Elmont NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Enhanced capture pads for through semiconductor vias Grant 9,040,418 - Farooq , et al. May 26, 2	2015-05-26
Enhanced capture pads for through semiconductor vias Grant 8,772,949 - Farooq , et al. July 8, 2	2014-07-08
Enhanced Capture Pads For Through Semiconductor Vias App 20140124946 - Farooq; Mukta G. ; et al.	2014-05-08
Enhanced Capture Pads For Through Semiconductor Vias App 20140127904 - Farooq; Mukta G. ; et al.	2014-05-08
Structures and methods to reduce maximum current density in a solder ball Grant 8,674,506 - Bezama , et al. March 18, 2	2014-03-18
Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20130234329 - BEZAMA; Raschid J. ; et al.	2013-09-12
Semiconductor structure having offset passivation to reduce electromigration Grant 8,487,447 - Interrante , et al. July 16, 2	2013-07-16
Structures and methods to reduce maximum current density in a solder ball Grant 8,446,006 - Bezama , et al. May 21, 2	2013-05-21
Semiconductor Structure Having Offset Passivation To Reduce Electromigration App 20120292779 - INTERRANTE; MARIO J. ; et al.	2012-11-22
Offset solder vias, methods of manufacturing and design structures Grant 8,298,929 - Daubenspeck , et al. October 30, 2	2012-10-30
Enhanced electromigration resistance in TSV structure and design Grant 8,288,270 - Farooq , et al. October 16, 2	2012-10-16
Enhanced Electromigration Resistance In Tsv Structure And Design App 20120199983 - Farooq; Mukta G. ; et al.	2012-08-09
Enhanced Electromigration Resistance In Tsv Structure And Design App 20120199975 - Farooq; Mukta G. ; et al.	2012-08-09
Enhanced electromigration resistance in TSV structure and design Grant 8,237,288 - Farooq , et al. August 7, 2	2012-08-07
Offset Solder Vias, Methods Of Manufacturing And Design Structures App 20120139123 - Daubenspeck; Timothy H. ; et al.	2012-06-07
Opto-electronic Module With Improved Low Power, High Speed Electrical Signal Integrity App 20110206379 - Budd; Russell A. ; et al.	2011-08-25
Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20110147922 - BEZAMA; Raschid J. ; et al.	2011-06-23
Clearance hole size adjustment for impedance control in multilayer electronic packaging and printed circuit boards Grant 7,271,681 - Dyckman , et al. September 18, 2	2007-09-18
Clearance Hole Size Adjustment For Impedance Control In Multilayer Electronic Packaging And Printed Circuit Boards App 20070008049 - Dyckman; Warren D. ; et al.	2007-01-11

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