LaBrie; Aaron
Patent Applications and Registrations
Patent applications and USPTO patent grants for LaBrie; Aaron.The latest application filed is for "apparatus and method for edge bevel removal of copper from silicon wafers".
- LaBrie; Aaron - Oregon City OR
| Patent | Date |
|---|---|
| Wafer chuck with aerodynamic design for turbulence reduction Grant 10,563,298 - Stephens , et al. Feb | 2020-02-18 |
| Wafer chuck with aerodynamic design for turbulence reduction Grant 9,732,416 - Stephens , et al. August 15, 2 | 2017-08-15 |
| Apparatus and method for edge bevel removal of copper from silicon wafers Grant 9,685,353 - Ganesan , et al. June 20, 2 | 2017-06-20 |
| Apparatus And Method For Edge Bevel Removal Of Copper From Silicon Wafers App 20140190529 - Ganesan; Kousik ; et al. | 2014-07-10 |
| Apparatus and method for edge bevel removal of copper from silicon wafers Grant 8,419,964 - Ganesan , et al. April 16, 2 | 2013-04-16 |
| Magnetically actuated chuck for edge bevel removal Grant 8,172,646 - Feng , et al. May 8, 2 | 2012-05-08 |
| Magnetically Actuated Chuck For Edge Bevel Removal App 20100219920 - Feng; Jingbin ; et al. | 2010-09-02 |
| Apparatus And Method For Edge Bevel Removal Of Copper From Silicon Wafers App 20100055924 - Ganesan; Kousik ; et al. | 2010-03-04 |
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