| Patent | Date |
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Tunable radiation source
Grant 8,785,217 - Gaynes , et al. July 22, 2 | 2014-07-22 |
Tunable Radiation Source
App 20130062740 - Gaynes; Michael A. ; et al. | 2013-03-14 |
SER testing for an IC chip using hot underfill
Grant 8,288,177 - Gaynes , et al. October 16, 2 | 2012-10-16 |
Negative thermal expansion system (NTES) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
Grant 8,241,957 - Hougham , et al. August 14, 2 | 2012-08-14 |
SER Testing for an IC Chip Using Hot Underfill
App 20120045853 - Gaynes; Michael ; et al. | 2012-02-23 |
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Composites and Conductive Elastomer Interconnects in Microelectronic Packaging
App 20110034047 - HOUGHAM; Gareth Geoffrey ; et al. | 2011-02-10 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging
Grant 7,883,919 - Hougham , et al. February 8, 2 | 2011-02-08 |
Method and system for collecting alignment data from coated chips or wafers
Grant 7,773,220 - Feger , et al. August 10, 2 | 2010-08-10 |
Discrete placement of radiation sources on integrated circuit devices
Grant 7,649,257 - Gordon , et al. January 19, 2 | 2010-01-19 |
Chip-level Underfill Process And Structures Thereof
App 20100003786 - Feger; Claudius ; et al. | 2010-01-07 |
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Compsites and Conductive Elastomer Interconnects in Microelectronic Packaging
App 20090263991 - Hougham; Gareth Geoffrey ; et al. | 2009-10-22 |
Method And System For Collecting Alignment Data From Coated Chips Or Wafers
App 20090251698 - Feger; Claudius ; et al. | 2009-10-08 |
Discreet Placement Of Radiation Sources On Integrated Circuit Devices
App 20090236699 - Gordon; Michael S. ; et al. | 2009-09-24 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
Grant 7,556,979 - Hougham , et al. July 7, 2 | 2009-07-07 |
Wafer-level Underfill Process Using Over-bump-applied Resin
App 20090108472 - Feger; Claudius ; et al. | 2009-04-30 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
Grant 7,417,315 - Hougham , et al. August 26, 2 | 2008-08-26 |
Negative Thermal Expansion System (NTES) Device for TCE Compensation in Elastomer Composites and Conductive Elastomer Interconnects in Microelectronic Packaging
App 20080048305 - Hougham; Gareth Geoffrey ; et al. | 2008-02-28 |
Packaging integrated circuits for accelerated detection of transient particle induced soft error rates
Grant 7,238,547 - Jones, legal representative , et al. July 3, 2 | 2007-07-03 |
Heterogeneous thermal interface for cooling
Grant 7,219,713 - Gelorme , et al. May 22, 2 | 2007-05-22 |
Packaging integrated circuits for accelerated detection of transient particle induced soft error rates
App 20060220654 - Zabel; Theodore H. ; et al. | 2006-10-05 |
Heterogeneous thermal interface for cooling
App 20060157223 - Gelorme; Jeffrey D. ; et al. | 2006-07-20 |
Method and apparatus for chip cooling using a liquid metal thermal interface
App 20060131738 - Furman; Bruce K. ; et al. | 2006-06-22 |
Method and apparatus for chip-cooling
Grant 7,063,127 - Gelorme , et al. June 20, 2 | 2006-06-20 |
Bilayer wafer-level underfill
Grant 6,924,171 - Buchwalter , et al. August 2, 2 | 2005-08-02 |
Method and apparatus for chip-cooling
App 20050061474 - Gelorme, Jeffrey D. ; et al. | 2005-03-24 |
Reworkable and thermally conductive adhesive and use thereof
Grant 6,777,817 - Buchwalter , et al. August 17, 2 | 2004-08-17 |
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
App 20040110322 - Hougham, Gareth Geoffrey ; et al. | 2004-06-10 |
Reworkable and thermally conductive adhesive and use thereof
App 20040041280 - Buchwalter, Stephen L. ; et al. | 2004-03-04 |
Reworkable and thermally conductive adhesive and use thereof
Grant 6,617,698 - Buchwalter , et al. September 9, 2 | 2003-09-09 |
Reworkable and thermally conductive adhesive and use thereof
App 20020171132 - Buchwalter, Stephen ; et al. | 2002-11-21 |
Bilayer wafer-level underfill
App 20020109228 - Buchwalter, Stephen L. ; et al. | 2002-08-15 |
Strippable photoimageable compositions
Grant 5,879,859 - Buchwalter , et al. March 9, 1 | 1999-03-09 |
Gel for localized removal of reworkable encapsulant
Grant 5,858,943 - Buchwalter , et al. January 12, 1 | 1999-01-12 |
Photoresist for use in ink jet printers and other micro-machining applications
Grant 5,859,655 - Gelorme , et al. January 12, 1 | 1999-01-12 |
Polyamic acid and polyimide from fluorinated reactant
Grant 5,464,927 - Angelopoulos , et al. November 7, 1 | 1995-11-07 |
Thermal stabilization of photoresist images
Grant 4,806,455 - LaBianca February 21, 1 | 1989-02-21 |
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