Kyung; You Jin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Kyung; You Jin.The latest application filed is for "non-conductive film and manufacturing method of semiconductor laminate".

Company Profile

7.20.26

Kyung; You Jin - Daejeon KR
Kyung; You-Jin - Seoul N/A KR
- Seoul KR
Kyung; You-Jin - Daejeon Metropolitan KR
Kyung; You-Jin - Daejeon Metropolitan City KR
Kyung, You-Jin - Daejeon-city KR
Kyung, You-Jin - Guro-ku KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for manufacturing insulating film and semiconductor package Grant 11,361,878 - Jeong , et al. June 14, 2	2022-06-14
Non-conductive Film And Manufacturing Method Of Semiconductor Laminate App 20210388244 - KIM; Eun Yeong ; et al.	2021-12-16
Method For Manufacturing Semiconductor Package App 20210313290 - KYUNG; You Jin ; et al.	2021-10-07
Adhesive Composition For Semiconductor Circuit Connection And Adhesive Film Containing The Same App 20210292616 - KIM; Junghak ; et al.	2021-09-23
Adhesive Composition For Semiconductor Circuit Connection, Adhesive Film For Semiconductor, Method For Manufacturing Semiconductor Package, And Semiconductor Package Using The Same App 20210292618 - KIM; Youngsam ; et al.	2021-09-23
Method For Manufacturing Insulating Layer For Semiconductor Package And Insulating Layer For Semiconductor Package Using The Same App 20200395288 - JEONG; Minsu ; et al.	2020-12-17
Epoxy Resin Composition For Molding Semiconductor, Molding Film And Semiconductor Package Using The Same App 20200347194 - JEONG; Minsu ; et al.	2020-11-05
Photo-curable and heat-curable resin composition and dry film solder resist Grant 10,795,259 - Choi , et al. October 6, 2	2020-10-06
Method For Manufacturing Insulating Film And Semiconductor Package App 20190189304 - JEONG; Woo Jae ; et al.	2019-06-20
Photo-curable And Heat-curable Resin Composition And Dry Film Solder Resist App 20190056658 - CHOI; Byung Ju ; et al.	2019-02-21
Preparation method for dry film solder resist and film laminate used therein Grant 9,788,434 - Jeong , et al. October 10, 2	2017-10-10
Photocurable and thermocurable resin composition and dry film solder resist Grant 9,778,566 - Choi , et al. October 3, 2	2017-10-03
Poly-amic acid, photo-sensitive resin composition, dry film, and circuit board Grant 9,410,017 - Kim , et al. August 9, 2	2016-08-09
Photocurable And Thermocurable Resin Composition And Dry Film Solder Resist App 20160116842 - CHOI; Byung Ju ; et al.	2016-04-28
Preparation Method For Dry Film Solder Resist And Film Laminate Used Therein App 20150366070 - JEONG; Min Su ; et al.	2015-12-17
Polyamic acid, photosensitive resin composition, dry film and circuit board Grant 9,049,778 - Kyung , et al. June 2, 2	2015-06-02
New Poly-amic Acid, Photo-sensitive Resin Composition, Dry Film, And Circuit Board App 20140296362 - Kim; Jung-Hak ; et al.	2014-10-02
Novel Polyamic Acid, Photosensitive Resin Composition, Dry Film And Circuit Board App 20140011905 - Kyung; You-Jin ; et al.	2014-01-09
Multi-component composite film method for preparing the same Grant 8,617,645 - Lee , et al. December 31, 2	2013-12-31
Multi-component composite film method for preparing the same Grant 08617645 -	2013-12-31
Alkali developable photosensitive resin composition and dry film manufactured by the same Grant 8,551,687 - Lee , et al. October 8, 2	2013-10-08
Photosensitive resin composition and dry film comprising the same Grant 8,354,219 - Kim , et al. January 15, 2	2013-01-15
Low temperature curable photosensitive resin composition and dry film manufactured by using the same Grant 8,288,656 - Lee , et al. October 16, 2	2012-10-16
Polyamic Acid, Polyimide, Photosensitive Resin Composition Comprising The Same, And Dry Film Manufactured From The Same App 20120012366 - LEE; Kwang-Joo ; et al.	2012-01-19
Photosensitive Resin Composition And Dry Film Comprising The Same App 20110278049 - KIM; Hee-Jung ; et al.	2011-11-17
Polyamic Acid, Polyimide, Photosensitive Resin Composition Comprising The Same And Dry Film Manufactured By The Same App 20110200939 - LEE; Kwang-Joo ; et al.	2011-08-18
Low Temperature Curable Photosensitive Resin Composition And Dry Film Manufactured By Using The Same App 20110067907 - LEE; Kwang-Joo ; et al.	2011-03-24
Alkali Developable Photosensitive Resin Composition And Dry Film Manufactured By The Same App 20100113640 - Lee; Kwang-Joo ; et al.	2010-05-06
Multi-component composite film method for preparing the same Grant 7,709,153 - Lee , et al. May 4, 2	2010-05-04
Multi-component Composite Film Method For Preparing The Same App 20090263591 - LEE; Seung-Jin ; et al.	2009-10-22
Double-sided metallic laminate and method for manufacturing the same Grant 7,491,447 - Park , et al. February 17, 2	2009-02-17
Multi-component Composite Film Method For Preparing The Same App 20090042104 - LEE; Seung-Jin ; et al.	2009-02-12
Multi-component composite film method for preparing the same Grant 7,470,488 - Lee , et al. December 30, 2	2008-12-30
Double-sided metallic laminate and method for manufacturing the same App 20070042202 - Park; Soon-yong ; et al.	2007-02-22
Multi-component composite membrane and method for preparing the same Grant 7,087,269 - Lee , et al. August 8, 2	2006-08-08
Electrochemical device using multicomponent composite membrane film Grant 7,014,948 - Lee , et al. March 21, 2	2006-03-21
High crystalline polypropylene microporous membrane, multi-component microporous membrane and methods for preparing the same Grant 6,830,849 - Lee , et al. December 14, 2	2004-12-14
Multi-component composite membrane and method for preparing the same App 20040213985 - Lee, Sang-Young ; et al.	2004-10-28
Polyimide copolymer and methods for preparing the same App 20040010062 - Ahn, Byeong-In ; et al.	2004-01-15
Electrochemical device using multicomponent composite membrane film App 20030104273 - Lee, Seung-Jin ; et al.	2003-06-05
High crystalline polypropylene microporous membrane, multicomponent microporous membrane and method for preparing the same App 20030031924 - Lee, Sang-Young ; et al.	2003-02-13
Multi-component composite film method for preparing the same App 20020187401 - Lee, Seung-Jin ; et al.	2002-12-12

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