| Patent | Date |
|---|
Methods of forming flip chip systems
Grant 10,236,267 - Lieu | 2019-03-19 |
Optical Module And Optical Module Package Incorporating A High-thermal-expansion Ceramic Substrate
App 20160377823 - GARLAND; Paul ; et al. | 2016-12-29 |
Heat management in electronics packaging
Grant 9,331,000 - Eblen , et al. May 3, 2 | 2016-05-03 |
Chip Attachment System
App 20160035686 - LIEU; Dinah | 2016-02-04 |
Heat Management In Electronics Packaging
App 20150287661 - EBLEN; Mark ; et al. | 2015-10-08 |
Printed circuit board impedance matching step for microwave (millimeter wave) devices
Grant 8,547,187 - Pao , et al. October 1, 2 | 2013-10-01 |
Broadband RF connector interconnect for multilayer electronic packages
Grant 7,808,341 - Aguirre October 5, 2 | 2010-10-05 |
Semiconductor package having non-ceramic based window frame
Grant 7,582,964 - Venegas , et al. September 1, 2 | 2009-09-01 |
Broadband RF connector interconnect for multilayer electronic packages
App 20080200068 - Aguirre; Gerardo | 2008-08-21 |
Semiconductor Package Having Non-Ceramic Based Window Frame
App 20080142963 - VENEGAS; Jeffrey ; et al. | 2008-06-19 |
Semiconductor package having non-ceramic based window frame
Grant 7,298,046 - Venegas , et al. November 20, 2 | 2007-11-20 |
Impedence matching along verticle path of microwave vias in multilayer packages
Grant 7,053,729 - Aguirre , et al. May 30, 2 | 2006-05-30 |
Matching for ring hybrid
App 20060109063 - Aguirre; Gerardo ; et al. | 2006-05-25 |
Impedence Matching Along Verticle Path Of Microwave Vias In Multilayer Packages
App 20060038633 - Aguirre; Gerardo ; et al. | 2006-02-23 |
Semiconductor package having filler metal of gold/silver/copper alloy
Grant 6,900,525 - Lobsinger , et al. May 31, 2 | 2005-05-31 |
Semiconductor package having filler metal of gold/silver/copper alloy
App 20040232529 - Lobsinger, Joshua David ; et al. | 2004-11-25 |
Semiconductor package having non-ceramic based window frame
App 20040195662 - Venegas, Jeffrey ; et al. | 2004-10-07 |
Opto-electronic package for integrated sealing of optical fibers
Grant 6,796,725 - Velsher , et al. September 28, 2 | 2004-09-28 |
Semiconductor substrate having copper/diamond composite material and method of making same
Grant 6,727,117 - McCoy April 27, 2 | 2004-04-27 |
Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough
Grant 6,703,559 - Kim , et al. March 9, 2 | 2004-03-09 |
Opto-electronic package for integrated sealing of optical fibers
App 20030068141 - Velsher, Benne ; et al. | 2003-04-10 |
Feedthrough assembly having cut-out areas in metal housing adjacent ceramic feedthrough
App 20030015350 - Kim, Franklin ; et al. | 2003-01-23 |
Ultra-low-loss feedthrough for microwave circuit package
Grant 6,441,697 - Garland , et al. August 27, 2 | 2002-08-27 |
Multi-layer ceramic packages
Grant 5,345,038 - Miyauchi , et al. September 6, 1 | 1994-09-06 |
Ceramic glass integrated circuit package with integral ground and power planes
Grant 5,258,575 - Beppu , et al. November 2, 1 | 1993-11-02 |
Method of using a contamination shield during the manufacture of EPROM semiconductor package windows
Grant 5,231,036 - Miyauchi , et al. July 27, 1 | 1993-07-27 |
Apparatus for manufacturing ceramic chip-resistant chamfered integrated circuit package
Grant 5,160,747 - Kizaki , et al. November 3, 1 | 1992-11-03 |
Partially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuit
Grant 5,137,767 - Miyauchi , et al. August 11, 1 | 1992-08-11 |
Method for making a ceramic lid for hermetic sealing of an EPROM circuit
Grant 5,043,004 - Miyauchi August 27, 1 | 1991-08-27 |
Ceramic-glass integrated circuit package with ground plane
Grant 4,992,628 - Beppu , et al. February 12, 1 | 1991-02-12 |
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