Kwon; Young I.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kwon; Young I..The latest application filed is for "multichip module packaging process for known good die burn-in".
- Kwon; Young I. - San Jose CA
- Kwon; Young I. - Santa Clara CA
| Patent | Date |
|---|---|
| Multichip module packaging process for known good die burn-in Grant 6,251,695 - Kwon June 26, 2 | 2001-06-26 |
| Embedded inter-connect frame Grant 5,462,624 - Kwon October 31, 1 | 1995-10-31 |
| Wire support and guide Grant 5,430,250 - Kwon * July 4, 1 | 1995-07-04 |
| Wire support and guide Grant 5,376,756 - Kwon December 27, 1 | 1994-12-27 |
| Method and apparatus for cooling a molded-plastic integrated-circuit package Grant 5,369,550 - Kwon November 29, 1 | 1994-11-29 |
| Integrated circuit package design having an intermediate die-attach substrate bonded to a leadframe Grant 5,365,409 - Kwon , et al. November 15, 1 | 1994-11-15 |
| Integrated circuit package having an interposer Grant 5,332,864 - Liang , et al. July 26, 1 | 1994-07-26 |
| Exposed die-attach heatsink package Grant 5,200,809 - Kwon April 6, 1 | 1993-04-06 |
| Thermally enhanced leadframe Grant 5,146,310 - Bayan , et al. September 8, 1 | 1992-09-08 |
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