Kwon; Yongtae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kwon; Yongtae.The latest application filed is for "chip package and manufacturing method thereof".
- Kwon; Yongtae - Cheongju-si KR
- Kwon; Yongtae - Seoul KR
| Patent | Date |
|---|---|
| Chip package with connection portion that passes through an encapsulation portion Grant 11,264,330 - Kwon , et al. March 1, 2 | 2022-03-01 |
| Dishwasher and controlling method therefor Grant 11,253,131 - Kwon February 22, 2 | 2022-02-22 |
| Semiconductor package of using insulating frame Grant 11,062,990 - Kwon , et al. July 13, 2 | 2021-07-13 |
| Chip Package And Manufacturing Method Thereof App 20210151379 - KWON; Yongtae ; et al. | 2021-05-20 |
| Dishwasher And Method Of Controlling The Same App 20210113054 - SON; Changwoo ; et al. | 2021-04-22 |
| Semiconductor Package Of Using Insulating Frame App 20190295944 - KWON; Yongtae ; et al. | 2019-09-26 |
| Dishwasher And Controlling Method Therefor App 20190059683 - KWON; Yongtae | 2019-02-28 |
| Network System App 20130227150 - Ahn; Junho ; et al. | 2013-08-29 |
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