| Patent | Date |
|---|
Electrolyte Including Mixture Of Active Material And Precursor Thereof
App 20210305610 - KWON; Yong Chai ; et al. | 2021-09-30 |
Method of fabricating a 3-D device
Grant 8,367,472 - Lee , et al. February 5, 2 | 2013-02-05 |
Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
Grant 8,053,807 - Kwon , et al. November 8, 2 | 2011-11-08 |
Method Of Fabricating A 3-d Device
App 20110171781 - LEE; Jong Ho ; et al. | 2011-07-14 |
Semiconductor package structure
Grant 7,939,947 - Kwon , et al. May 10, 2 | 2011-05-10 |
Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate
Grant 7,915,710 - Lee , et al. March 29, 2 | 2011-03-29 |
Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same
Grant 7,884,875 - Kwon , et al. February 8, 2 | 2011-02-08 |
Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
App 20110014748 - Kwon; Yong-Chai ; et al. | 2011-01-20 |
Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
Grant 7,825,468 - Kwon , et al. November 2, 2 | 2010-11-02 |
Semiconductor Package Structure
App 20100207278 - Kwon; Yong-Chai ; et al. | 2010-08-19 |
Semiconductor structure and method for forming the same
Grant 7,777,323 - Kwon , et al. August 17, 2 | 2010-08-17 |
Semiconductor device having through electrode and method of fabricating the same
Grant 7,777,345 - Lee , et al. August 17, 2 | 2010-08-17 |
Method of fabricating semiconductor package structure
Grant 7,732,328 - Kwon , et al. June 8, 2 | 2010-06-08 |
Semiconductor device having through vias
Grant 7,602,047 - Kwon , et al. October 13, 2 | 2009-10-13 |
Methods of stacking semiconductor devices and methods of fabricating semiconductor device packages using the same
Grant 7,588,964 - Kwon , et al. September 15, 2 | 2009-09-15 |
Semiconductor device packages and methods of fabricating the same
App 20090186446 - Kwon; Yong-Chai ; et al. | 2009-07-23 |
Image sensor device and method of manufacturing the same
Grant 7,534,656 - Kwon , et al. May 19, 2 | 2009-05-19 |
Semiconductor Device And Method Of Fabricating The Same
App 20090121323 - KWON; Yong-Chai ; et al. | 2009-05-14 |
Assembly having wafer with image sensor chips, a photo-sensitive adhesive pattern and plate thereof and method of manufacturing the same
Grant 7,521,657 - Kwon , et al. April 21, 2 | 2009-04-21 |
Method of fabricating a 3-D device and device made thereby
App 20090032966 - Lee; Jong Ho ; et al. | 2009-02-05 |
Semiconductor Device Having Through Electrode And Method Of Fabricating The Same
App 20090008790 - LEE; Ho-Jin ; et al. | 2009-01-08 |
Stack circuit member and method
App 20080318363 - Kwon; Yong-Chai ; et al. | 2008-12-25 |
Stacked chip package using photosensitive polymer and manufacturing method thereof
Grant 7,459,774 - Kwon , et al. December 2, 2 | 2008-12-02 |
Semiconductor Packages Having Immunity Against Void Due To Adhesive Material And Methods Of Fabricating The Same
App 20080179727 - KWON; Yong-Chai ; et al. | 2008-07-31 |
Stacked Package, Method Of Manufacturing The Same, And Memory Card Having The Stacked Package
App 20080179734 - KWON; Yong-Chai ; et al. | 2008-07-31 |
Stacked structure of semiconductor devices, semiconductor device package, and methods of fabricating the same
App 20080169545 - Kwon; Yong-Chai ; et al. | 2008-07-17 |
Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
App 20080157394 - Kwon; Yong-Chai ; et al. | 2008-07-03 |
Semiconductor device having through vias and method of manufacturing the same
App 20080150089 - Kwon; Yong-Chai ; et al. | 2008-06-26 |
Image sensor device and methods thereof
Grant 7,371,614 - Kwon , et al. May 13, 2 | 2008-05-13 |
Camera Module And Method Of Fabricating The Same
App 20080087974 - KWON; Yong-Chai ; et al. | 2008-04-17 |
Semiconductor Package Structure And Method Of Fabricating The Same
App 20080088031 - KWON; Yong-Chai ; et al. | 2008-04-17 |
Image sensor device and method of manufacturing the same
App 20070264745 - Kwon; Yong-Chai ; et al. | 2007-11-15 |
Image sensor device and method of manufacturing same
Grant 7,262,475 - Kwon , et al. August 28, 2 | 2007-08-28 |
Stacked chip package using warp preventing insulative material and manufacturing method thereof
App 20070045836 - Kwon; Yong-Chai ; et al. | 2007-03-01 |
Stacked chip package using photosensitive polymer and manufacturing method thereof
App 20070048969 - Kwon; Yong-Chai ; et al. | 2007-03-01 |
Image sensor device and methods thereof
App 20070019089 - Kwon; Yong-Chai ; et al. | 2007-01-25 |
Chip-embedded interposer structure and fabrication method thereof, wafer level stack structure and resultant package structure
App 20070007641 - Lee; Kang-Wook ; et al. | 2007-01-11 |
Method of manufacturing optical device having transparent cover and method of manufacturing optical device module using the same
App 20070010041 - Kang; Suk-Chae ; et al. | 2007-01-11 |
Stack circuit member and method
App 20060278991 - Kwon; Yong-Chai ; et al. | 2006-12-14 |
Image sensor device and method of manufacturing same
App 20060151847 - Kwon; Yong-Chai ; et al. | 2006-07-13 |
Image sensor chip having plate, wafer assembly and manufacturing method for the same
App 20060152615 - Kwon; Yong-Chai ; et al. | 2006-07-13 |
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