| Patent | Date |
|---|
Low Cost Package Structure For High Performance ML Memory Interface To Improve Perf/TCO
App 20220238504 - Kim; Namhoon ; et al. | 2022-07-28 |
Backside Interconnection Interface Die For Integrated Circuits Package
App 20220189934 - Kim; Namhoon ; et al. | 2022-06-16 |
Backside Integrated Voltage Regulator For Integrated Circuits
App 20220157787 - Kim; Namhoon ; et al. | 2022-05-19 |
Asic Package With Photonics And Vertical Power Delivery
App 20220139876 - Kwon; Woon-Seong ; et al. | 2022-05-05 |
Backside integrated voltage regulator for integrated circuits
Grant 11,276,668 - Kim , et al. March 15, 2 | 2022-03-15 |
Integrated circuit substrate for containing liquid adhesive bleed-out
Grant 11,264,295 - Kwon , et al. March 1, 2 | 2022-03-01 |
ASIC package with photonics and vertical power delivery
Grant 11,264,358 - Kwon , et al. March 1, 2 | 2022-03-01 |
Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies
App 20210375715 - Kwon; Woon-Seong ; et al. | 2021-12-02 |
Methods And Heat Distribution Devices For Thermal Management Of Chip Assemblies
App 20210378106 - Iyengar; Madhusudan K. ; et al. | 2021-12-02 |
Deep Trench Capacitors Embedded In Package Substrate
App 20210273042 - Kim; Nam Hoon ; et al. | 2021-09-02 |
Backside Integrated Voltage Regulator For Integrated Circuits
App 20210249384 - Kim; Nam Hoon ; et al. | 2021-08-12 |
Asic Package With Photonics And Vertical Power Delivery
App 20210074677 - Kwon; Woon-Seong ; et al. | 2021-03-11 |
Integrated Circuit Substrate For Containing Liquid Adhesive Bleed-Out
App 20210074601 - Kwon; Woon-Seong ; et al. | 2021-03-11 |
Wafer level fan-out application specific integrated circuit bridge memory stack
Grant 10,930,592 - Kim , et al. February 23, 2 | 2021-02-23 |
Massive deep trench capacitor die fill for high performance application specific integrated circuit (ASIC) applications
Grant 10,896,873 - Kwon , et al. January 19, 2 | 2021-01-19 |
Wafer Level Fan-out Application Specific Integrated Circuit Bridge Memory Stack
App 20200357743 - Kim; Nam Hoon ; et al. | 2020-11-12 |
Integrated circuit substrate for containing liquid adhesive bleed-out
Grant 10,818,567 - Kwon , et al. October 27, 2 | 2020-10-27 |
Cooling Electronic Devices In A Data Center
App 20200296862 - Iyengar; Madhusudan Krishnan ; et al. | 2020-09-17 |
Integrated Circuit Substrate For Containing Liquid Adhesive Bleed-out
App 20200185292 - Kwon; Woon Seong ; et al. | 2020-06-11 |
Cooling electronic devices in a data center
Grant 10,681,846 - Iyengar , et al. | 2020-06-09 |
Massive Deep Trench Capacitor Die Fill For High Performance Application Specific Integrated Circuit (asic) Applications
App 20200161235 - Kwon; Woon Seong ; et al. | 2020-05-21 |
High bandwidth memory package for high performance processors
Grant 10,658,322 - Kwon , et al. | 2020-05-19 |
Apparatus and mechanisms for reducing warpage and increasing surface mount technology yields in high performance integrated circuit packages
Grant 10,643,913 - Kwon , et al. | 2020-05-05 |
High Bandwidth Memory Package For High Performance Processors
App 20200098715 - Kwon; Woon Seong ; et al. | 2020-03-26 |
Cooling electronic devices in a data center
Grant 10,548,240 - Iyengar , et al. Ja | 2020-01-28 |
Cooling electronic devices in a data center
Grant 10,548,239 - Iyengar , et al. Ja | 2020-01-28 |
High bandwidth memory package for high performance processors
Grant 10,515,920 - Kwon , et al. Dec | 2019-12-24 |
Package stiffener for protecting semiconductor die
Grant 10,468,359 - Edwards , et al. No | 2019-11-05 |
Multi-chip silicon substrate-less chip packaging
Grant 10,468,351 - Kwon , et al. No | 2019-11-05 |
Cooling Electronic Devices In A Data Center
App 20190327859 - Iyengar; Madhusudan Krishnan ; et al. | 2019-10-24 |
High Bandwidth Memory Package For High Performance Processors
App 20190312002 - Kwon; Woon Seong ; et al. | 2019-10-10 |
Apparatus And Mechanisms For Reducing Warpage And Increasing Surface Mount Technology Yields In High Performance Integrated Circ
App 20190172767 - Kwon; Woon Seong ; et al. | 2019-06-06 |
Embedded air gap transmission lines
Grant 10,257,921 - Roy , et al. | 2019-04-09 |
Integration Of Silicon Photonics Ic For High Data Rate
App 20180299628 - Liu; Hong ; et al. | 2018-10-18 |
Package stiffener for protecting semiconductor die
Grant 10,083,920 - Edwards , et al. September 25, 2 | 2018-09-25 |
Integration of silicon photonics IC for high data rate
Grant 10,025,047 - Liu , et al. July 17, 2 | 2018-07-17 |
Protective barrier for integrated circuit packages housing a voltage regulator and a load
Grant 9,966,345 - Sizikov , et al. May 8, 2 | 2018-05-08 |
Techniques for molded underfill for integrated circuit dies
Grant 9,831,104 - Kwon , et al. November 28, 2 | 2017-11-28 |
Interposer with edge reinforcement and method for manufacturing same
Grant 9,627,329 - Kwon , et al. April 18, 2 | 2017-04-18 |
Methods for flip chip stacking
Grant 9,508,563 - Kwon , et al. November 29, 2 | 2016-11-29 |
Semiconductor assembly having bridge module for die-to-die interconnection
Grant 9,418,966 - Kwon , et al. August 16, 2 | 2016-08-16 |
Multi-chip Silicon Substrate-less Chip Packaging
App 20160064328 - Kwon; Woon-Seong ; et al. | 2016-03-03 |
Integrated circuit package with multi-trench structure on flipped substrate contacting underfill
Grant 9,245,865 - Kwon , et al. January 26, 2 | 2016-01-26 |
Multi-die integrated circuits implemented using spacer dies
Grant 9,224,697 - Kwon , et al. December 29, 2 | 2015-12-29 |
Solder bump structure with enhanced high temperature aging reliability and method for manufacturing same
Grant 9,147,661 - Kwon , et al. September 29, 2 | 2015-09-29 |
Warpage management for fan-out mold packaged integrated circuit
Grant 9,006,030 - Kwon , et al. April 14, 2 | 2015-04-14 |
Substrate-less interposer technology for a stacked silicon interconnect technology (SSIT) product
Grant 8,946,884 - Kwon , et al. February 3, 2 | 2015-02-03 |
Semiconductor package and method of manufacturing the same
Grant 8,852,988 - Jang , et al. October 7, 2 | 2014-10-07 |
Multi-layer Core Organic Package Substrate
App 20140262440 - Kim; Namhoon ; et al. | 2014-09-18 |
Substrate-less Interposer Technology For A Stacked Silicon Interconnect Technology (ssit) Product
App 20140252599 - Kwon; Woon-Seong ; et al. | 2014-09-11 |
Methods For Flip Chip Stacking
App 20140017852 - Kwon; Woon-Seong ; et al. | 2014-01-16 |
Methods for flip chip stacking
Grant 8,618,648 - Kwon , et al. December 31, 2 | 2013-12-31 |
Methods for flip chip stacking
Grant 08618648 - | 2013-12-31 |
Method of processing a wafer
Grant 8,603,917 - Kwon , et al. December 10, 2 | 2013-12-10 |
Semiconductor Package And Method Of Manufacturing The Same
App 20130267057 - Jang; Hyung-Sun ; et al. | 2013-10-10 |
Semiconductor package and method of manufacturing the same
Grant 8,466,527 - Jang , et al. June 18, 2 | 2013-06-18 |
Method Of Processing A Wafer
App 20120178258 - Kwon; Woon Seong ; et al. | 2012-07-12 |
Camera modules and methods of fabricating the same
Grant 8,114,701 - Kwon , et al. February 14, 2 | 2012-02-14 |
Semiconductor Package And Method Of Manufacturing The Same
App 20110180892 - JANG; Hyung-Sun ; et al. | 2011-07-28 |
Camera module and electronic apparatus having the same
Grant 7,948,555 - Kwon , et al. May 24, 2 | 2011-05-24 |
Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package
Grant 7,893,514 - Kwon , et al. February 22, 2 | 2011-02-22 |
Image sensor having through via
Grant 7,884,392 - Lee , et al. February 8, 2 | 2011-02-08 |
Method Of Manufacturing A Semiconductor Device Having An Even Coating Thickness Using Electro-less Plating And Related Device
App 20100320500 - KANG; UN BYOUNG ; et al. | 2010-12-23 |
Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
Grant 7,786,581 - Kang , et al. August 31, 2 | 2010-08-31 |
Stack Type Semiconductor Chip Package Having Different Type Of Chips And Fabrication Method Thereof
App 20100019338 - KWON; Woon-Seong ; et al. | 2010-01-28 |
Stack type semiconductor chip package having different type of chips and fabrication method thereof
Grant 7,619,315 - Kwon , et al. November 17, 2 | 2009-11-17 |
Camera module, method of manufacturing the same, and electronic system having the same
App 20090256931 - Lee; Chung-Sun ; et al. | 2009-10-15 |
Image Sensor Having Through Via
App 20090200632 - LEE; Hyuek-Jae ; et al. | 2009-08-13 |
Camera Modules And Methods Of Fabricating The Same
App 20090130791 - KWON; Woon-Seong ; et al. | 2009-05-21 |
Camera Module And Electronic Apparatus Having The Same
App 20090122178 - KWON; Yong-Hwan ; et al. | 2009-05-14 |
Semiconductor Package With Through Silicon Via And Related Method Of Fabrication
App 20080284041 - JANG; Hyung-sun ; et al. | 2008-11-20 |
Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device
App 20080258299 - Kang; Un Byoung ; et al. | 2008-10-23 |
Image Sensor Package, Method Of Manufacturing The Same, And Image Sensor Module Including The Image Sensor Package
App 20080251872 - KWON; Woon-Seong ; et al. | 2008-10-16 |
Stack Type Semiconductor Chip Package Having Different Type Of Chips And Fabrication Method Thereof
App 20080169546 - KWON; Woon-Seong ; et al. | 2008-07-17 |
Bump Electrode Including Plating Layers And Method Of Fabricating The Same
App 20080083983 - JANG; Hyang-sun ; et al. | 2008-04-10 |
Semiconductor Package Including Silver Bump And Method For Fabricating The Same
App 20080054456 - KANG; Un-byoung ; et al. | 2008-03-06 |
Image Sensor Package, Related Method Of Manufacture And Image Sensor Module
App 20080055438 - Lee; Chung-sun ; et al. | 2008-03-06 |
Image sensor package and method of fabricating the same
App 20080012084 - Kwon; Yong-Hwan ; et al. | 2008-01-17 |
Method for manufacturing conductive adhesive for high frequency flip chip package application
App 20020111423 - Paik, Kyung wook ; et al. | 2002-08-15 |
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