Kwon; Jun Hyuk
Patent Applications and Registrations
Patent applications and USPTO patent grants for Kwon; Jun Hyuk.The latest application filed is for "connector assembly and method of manufacturing socket for connector assembly".
- Kwon; Jun Hyuk - Gyeonggi-Do KR
- Kwon; Jun Hyuk - Suwon-si KR
- Kwon; Jun-Hyuk - Gunpo-si N/A KR
| Patent | Date |
|---|---|
| Connector assembly and method of manufacturing socket for connector assembly Grant 10,840,642 - Kwon , et al. November 17, 2 | 2020-11-17 |
| Connector Assembly And Method Of Manufacturing Socket For Connector Assembly App 20190190206 - Kwon; Gi Chan ; et al. | 2019-06-20 |
| Floor panel having adhesive applied sheet Grant 9,657,482 - Ko , et al. May 23, 2 | 2017-05-23 |
| Chip through flooring material using PLA resin Grant 9,623,635 - Huang , et al. April 18, 2 | 2017-04-18 |
| Floor material using PLA resin Grant 9,517,612 - Huang , et al. December 13, 2 | 2016-12-13 |
| Chip-inlaid flooring material using PLA resin Grant 9,422,729 - Kwon , et al. August 23, 2 | 2016-08-23 |
| Floor Panel Having Adhesive Applied Sheet App 20150044409 - Ko; Hae Seung ; et al. | 2015-02-12 |
| Flooring Material Using Poly Lactic Acid Resin And Construction Methods Of The Same App 20140370225 - Ko; Hae Seung ; et al. | 2014-12-18 |
| Flooring Using Pvc And Method Of Constructing The Flooring App 20140360117 - Ko; Hae Seung ; et al. | 2014-12-11 |
| Chip-inlaid Flooring Material Using Pla Resin App 20130302577 - Kwon; Hyun-Jong ; et al. | 2013-11-14 |
| Board Complex Having Pla Cover App 20130004703 - Kwon; Hyun-Jong ; et al. | 2013-01-03 |
| Floor Material Using Pla Resin App 20130004751 - Huang; Cheng-Zhe ; et al. | 2013-01-03 |
| Chip Through Flooring Material Using Pla Resin App 20120231256 - Huang; Cheng-Zhe ; et al. | 2012-09-13 |
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