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Patent applications and USPTO patent grants for Kwon; Jun Hyuck.The latest application filed is for "method and apparatus for atomic layer etching".
Patent | Date |
---|---|
Atomic layer etching method Grant 11,450,531 - Kwon , et al. September 20, 2 | 2022-09-20 |
Method And Apparatus For Atomic Layer Etching App 20220059325 - JIN; Kwang Seon ;   et al. | 2022-02-24 |
Substrate Processing Method App 20210193472 - JIN; Kwang Seon ;   et al. | 2021-06-24 |
Atomic Layer Etching Method App 20210193473 - KWON; Jun Hyuck ;   et al. | 2021-06-24 |
Precursor for vapor deposition having excellent thermal stability and preparing method thereof Grant 10,490,409 - Park , et al. Nov | 2019-11-26 |
Precursor For Vapor Deposition Having Excellent Thermal Stability And Preparing Method Thereof App 20180122645 - PARK; Jung-Woo ;   et al. | 2018-05-03 |
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