| Patent | Date |
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Adhesive/spacer island structure for multiple die package
Grant 8,623,704 - Lee , et al. January 7, 2 | 2014-01-07 |
Adhesive/spacer island structure for stacking over wire bonded die
Grant 8,552,551 - Lee , et al. October 8, 2 | 2013-10-08 |
Method for manufacturing wafer scale heat slug system
Grant 8,375,576 - Kwon February 19, 2 | 2013-02-19 |
Integrated circuit package system including honeycomb molding
Grant 8,217,501 - Kwon , et al. July 10, 2 | 2012-07-10 |
Stacked integrated circuit and package system and method for manufacturing thereof
Grant 8,102,043 - Jeong , et al. January 24, 2 | 2012-01-24 |
Integrated circuit package system with planar interconnects
Grant 8,067,831 - Kwon , et al. November 29, 2 | 2011-11-29 |
Integrated circuit package-in-package system and method for making thereof
Grant 8,049,322 - Yim , et al. November 1, 2 | 2011-11-01 |
Method For Manufacturing Wafer Scale Heat Slug System
App 20110239459 - Kwon; Hyeog Chan | 2011-10-06 |
Stacked semiconductor package having adhesive/spacer structure and insulation
Grant 8,030,134 - Kwon , et al. October 4, 2 | 2011-10-04 |
Wafer scale heat slug system
Grant 7,975,377 - Kwon July 12, 2 | 2011-07-12 |
Stacked Integrated Circuit And Package System And Method For Manufacturing Thereof
App 20110108976 - Jeong; Tae Sung ; et al. | 2011-05-12 |
Multipackage module having stacked packages with asymmetrically arranged die and molding
Grant 7,932,593 - Kwon April 26, 2 | 2011-04-26 |
Integrated circuit packaging system with carrier and method of manufacture thereof
Grant 7,884,460 - Yim , et al. February 8, 2 | 2011-02-08 |
Stacked integrated circuit and package system
Grant 7,875,966 - Jeong , et al. January 25, 2 | 2011-01-25 |
Integrated Circuit Package System Including Honeycomb Molding
App 20100237488 - Kwon; Hyeog Chan ; et al. | 2010-09-23 |
Integrated Circuit Package-in-package System And Method For Making Thereof
App 20100230796 - Yim; Choong Bin ; et al. | 2010-09-16 |
Integrated circuit package-in-package system
Grant 7,755,180 - Yim , et al. July 13, 2 | 2010-07-13 |
Integrated circuit package system including honeycomb molding
Grant 7,737,539 - Kwon , et al. June 15, 2 | 2010-06-15 |
Integrated circuit package system including stacked die
Grant 7,652,376 - Park , et al. January 26, 2 | 2010-01-26 |
Multipackage Module Having Stacked Packages With Asymmetrically Arranged Die And Molding
App 20090218675 - Kwon; Hyeog Chan | 2009-09-03 |
Multipackage module having stacked packages with asymmetrically arranged die and molding
Grant 7,545,031 - Kwon June 9, 2 | 2009-06-09 |
Integrated Circuit Packaging System With Carrier And Method Of Manufacture Thereof
App 20090134509 - Yim; Choong Bin ; et al. | 2009-05-28 |
Integrated circuit package system
Grant 7,501,697 - Yim , et al. March 10, 2 | 2009-03-10 |
Integrated Circuit Package System Including Stacked Die
App 20090014899 - Park; Soo-San ; et al. | 2009-01-15 |
Integrated circuit package system including stacked die
Grant 7,456,088 - Park , et al. November 25, 2 | 2008-11-25 |
Integrated Circuit Package-in-package System
App 20080006925 - Yim; Choong Bin ; et al. | 2008-01-10 |
Semiconductor chip packaging method with individually placed film adhesive pieces
Grant 7,306,971 - Jeong , et al. December 11, 2 | 2007-12-11 |
Integrated circuit package-in-package system
Grant 7,288,835 - Yim , et al. October 30, 2 | 2007-10-30 |
Integrated Circuit Package-in-package System
App 20070216005 - Yim; Choong Bin ; et al. | 2007-09-20 |
Integrated Circuit Package System
App 20070216010 - Yim; Choong Bin ; et al. | 2007-09-20 |
Integrated Circuit Package System Including Honeycomb Molding
App 20070158806 - Kwon; Hyeog Chan ; et al. | 2007-07-12 |
Integrated Circuit Package System Including Stacked Die
App 20070158833 - Park; Soo-San ; et al. | 2007-07-12 |
Wafer Scale Heat Slug System
App 20070109749 - Kwon; Hyeog Chan | 2007-05-17 |
Stacked Die Packaging System
App 20070085184 - Kwon; Hyeog Chan ; et al. | 2007-04-19 |
Integrated Circuit Package System With Planar Interconnects
App 20070063331 - Kwon; Hyeog Chan ; et al. | 2007-03-22 |
Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation
App 20070018296 - Kwon; Hyeog Chan ; et al. | 2007-01-25 |
Stacked Semiconductor Package having Adhesive/Spacer Structure and Insulation
App 20070013060 - Kwon; Hyeog Chan ; et al. | 2007-01-18 |
Adhesive/Spacer Island Structure for Multiple Die Package
App 20070015314 - Lee; Sang Ho ; et al. | 2007-01-18 |
Multipackage module having stacked packages with asymmetrically arranged die and molding
App 20060226528 - Kwon; Hyeog Chan | 2006-10-12 |
Stacked integrated circuit and package system
App 20060180911 - Jeong; Tae Sung ; et al. | 2006-08-17 |
Adhesive/spacer island structure for stacking over wire bonded die
App 20050269676 - Lee, Sang Ho ; et al. | 2005-12-08 |
Stacked semiconductor package having adhesive/spacer structure and insulation
App 20050269692 - Kwon, Hyeog Chan ; et al. | 2005-12-08 |
Adhesive/spacer island structure for multiple die package
App 20050258527 - Lee, Sang Ho ; et al. | 2005-11-24 |
Multiple die package with adhesive/spacer structure and insulated die surface
App 20050258545 - Kwon, Hyeog Chan | 2005-11-24 |
Die with discrete spacers and die spacing method
App 20050224959 - Kwon, Hyeog Chan ; et al. | 2005-10-13 |
Die to substrate attach using printed adhesive
App 20050208700 - Kwon, Hyeog Chan ; et al. | 2005-09-22 |
Semiconductor chip packaging method with individually placed film adhesive pieces
App 20050208701 - Jeong, Jin-Wook ; et al. | 2005-09-22 |
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