KWON; HEUNGKYU

Patent Applications and Registrations

Patent applications and USPTO patent grants for KWON; HEUNGKYU.The latest application filed is for "electronic device and operating method".

Company Profile

1.20.31

KWON; HEUNGKYU - SEONGNAM-SI KR
Kwon; Heungkyu - Hwasung KR
KWON; HEUNGKYU - Hwasung-City KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic Device And Operating Method App 20220272514 - KWON; HEUNGKYU ; et al.	2022-08-25
Semiconductor Package Including Dual Stiffener App 20220208624 - KWON; HEUNGKYU ; et al.	2022-06-30
Hybrid Semiconductor Device And Electronic Device App 20220181274 - KWON; HEUNGKYU ; et al.	2022-06-09
Semiconductor package system Grant 11,244,885 - Kwon February 8, 2	2022-02-08
Semiconductor Package System App 20210358831 - KWON; Heungkyu	2021-11-18
Semiconductor Package System App 20210233827 - KWON; Heungkyu	2021-07-29
Semiconductor package system Grant 11,075,138 - Kwon July 27, 2	2021-07-27
Semiconductor package Grant 11,069,623 - Kwon July 20, 2	2021-07-20
Semiconductor package system Grant 10,991,638 - Kwon April 27, 2	2021-04-27
Semiconductor Module App 20200235083 - KWON; Heungkyu	2020-07-23
Semiconductor Package System App 20200091030 - KWON; Heungkyu	2020-03-19
Semiconductor Package App 20190355667 - Kwon; Heungkyu	2019-11-21
Semiconductor Package System App 20190348343 - Kwon; Heungkyu	2019-11-14
Semiconductor Package System App 20190348340 - KWON; Heungkyu	2019-11-14
Surface temperature management method of mobile device and memory thermal management method of multichip package Grant 10,198,049 - Kwon , et al. Fe	2019-02-05
Package-on-package type semiconductor package and method of fabricating the same Grant 10,068,881 - Kwon September 4, 2	2018-09-04
Chip using triple pad configuration and packaging method thereof Grant 9,859,237 - Kwon , et al. January 2, 2	2018-01-02
Package-on-package Type Semiconductor Package And Method Of Fabricating The Same App 20170194299 - KWON; Heungkyu	2017-07-06
Semiconductor packages Grant 9,698,088 - Kwon , et al. July 4, 2	2017-07-04
Surface Temperature Management Method Of Mobile Device And Memory Thermal Management Method Of Multichip Package App 20170185119 - KWON; Heungkyu ; et al.	2017-06-29
Surface temperature management method of mobile device and memory thermal management method of multichip package Grant 9,606,591 - Kwon , et al. March 28, 2	2017-03-28
Semiconductor Packages App 20160240509 - KWON; Heungkyu ; et al.	2016-08-18
Semiconductor packages including a metal layer between first and second semiconductor chips Grant 9,390,992 - Kwon , et al. July 12, 2	2016-07-12
Chip Using Triple Pad Configuration And Packaging Method Thereof App 20160133585 - KWON; HEUNGKYU ; et al.	2016-05-12
Semiconductor package including stacked memory chips Grant 9,214,441 - Kwon , et al. December 15, 2	2015-12-15
Semiconductor package and method of forming the same Grant 8,981,543 - Kwon , et al. March 17, 2	2015-03-17
Semiconductor Package App 20150048521 - KWON; Heungkyu ; et al.	2015-02-19
Package-on-package device and method of fabricating the same Grant 8,952,517 - Kwon , et al. February 10, 2	2015-02-10
Semiconductor Packages Including A Metal Layer Between First And Second Semiconductor Chips App 20150014862 - Kwon; Heungkyu ; et al.	2015-01-15
Semiconductor Package And Method Of Fabricating The Same App 20140374900 - Kwon; Heungkyu ; et al.	2014-12-25
Method of forming a semiconductor package Grant 8,709,879 - Park , et al. April 29, 2	2014-04-29
Semiconductor Package And Method Of Forming The Same App 20140035137 - KWON; HEUNGKYU ; et al.	2014-02-06
Package-on-package Device And Method Of Fabricating The Same App 20140001653 - KWON; HEUNGKYU ; et al.	2014-01-02
Semiconductor Package And Method Of Manufacturing The Same App 20130203219 - PARK; Ji-hyun ; et al.	2013-08-08
Semiconductor package and method of manufacturing the same Grant 8,426,959 - Park , et al. April 23, 2	2013-04-23
Surface Temperature Management Method Of Mobile Device And Memory Thermal Management Method Of Multichip Package App 20130091348 - KWON; Heungkyu ; et al.	2013-04-11
Semiconductor Packages App 20120299197 - KWON; Heungkyu ; et al.	2012-11-29
Semiconductor Package App 20120074595 - Ha; JeongOh ; et al.	2012-03-29
Semiconductor Package And Method Of Manufacturing The Same App 20110042797 - Park; Ji-hyun ; et al.	2011-02-24

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